Through Silicon Via Patents: Top Companies & Filing Trends 2026
Through Silicon Via Formation Patents: Who Leads and Where Filings Are Heading
Filings peaked in 2021 at 179 and fell 54% by 2024 (82), though 2025-26 figures are still filling in as publications lag filing by about 18 months. Filings ran at 170 in 2017, climbed to a peak of 179 in 2021, then declined to 82 by 2024 — a 54% drop over that three-year span. 2025 and 2026 values are shown but should be read as incomplete, since publication typically lags filing by roughly 18 months.
- 1TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD6.9%
- 2SILVEBROOK KIA5.0%
- 3HUAWEI TECH CO LTD3.3%
- 4COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES3.2%
- 5IRIDIA INC2.7%
See the full through silicon via formation analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about Through Silicon Via patents
Who holds the most Through Silicon Via formation patents?
One assignee leads the ranked list with 138 records, well ahead of the fifth-place filer at 55 and tenth place at 45. The top 5 assignees combined account for 21.1% of the 2,006 records in scope, and the top 10 for 33.3%, meaning that even with a clear leader, roughly two-thirds of filings sit outside the leading ten companies. This points to a field with an identifiable leader but no single dominant gatekeeper.
Is Through Silicon Via patent filing activity growing or slowing down?
Filing volume rose through the late 2010s and peaked in 2021 at 179 records, then fell to 82 by 2024 — a 54% decline over that three-year span. Because patent publication typically lags filing by around 18 months, the 2025 and 2026 figures in the dataset are still incomplete and should not be read as confirming a continued slowdown. The 2021-2024 window is the most reliable comparison available right now.
What patent classes cover Through Silicon Via technology?
The bulk of records, 66.2% of the 2,006 in scope, classify under H01L, the general semiconductor devices subclass. Packaging-specific classes H10W (22.2%) and H10P (9.7%) follow, alongside MEMS-related classes B81B (5.8%) and B81C (4.7%) and digital-processing class G06F (4.6%). Since a single record can carry multiple IPC classes, these shares add up to more than 100% of the record total, which is expected.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Through Silicon Via Formation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.