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Titanium Alloy AI/ML Patent Snapshot 2026

Titanium Alloy AI/ML Patent Snapshot 2026
Evidence Snapshot
Titanium Alloy AI/ML Patent Snapshot in 2026

The application of AI and machine learning to titanium alloy research is an emerging, lightly-patented field with 16 patent families in scope, where RTX Corp leads a fragmented field that is otherwise dominated by Chinese academic institutions. Activity has accelerated sharply from 2022 onward, making this a nascent space with significant open territory for industrial players.

16
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
China
Leading jurisdiction
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Published byPatsnap Insights Team··5 min readVerified by Patsnap Eureka data
Overview

RTX Corp leads a fragmented, academically dominated field

RTX Corp holds the top position with 3 patent families, ahead of Sardar Beant Singh State University Gurdaspur with 2 patent families; all remaining ranked applicants hold 1 patent family each. The top five filers together account for 47% of the ranked applicants visible in this query’ combined total, indicating moderate concentration at the apex but a long, flat tail of single-family holders.

No second industrial player yet matches RTX Corp’s position. The remaining 13 ranked applicants are entirely composed of universities and one precision forging company, signaling that industrial IP development outside RTX Corp is essentially absent at this stage.

Leading applicants
#ApplicantPatent familiesShare
1RTX Corp3
2Sardar Beant Singh State University Gurdaspur2
3UNIV OF SCI & TECH BEIJING1
4Xi’an Jiaotong University1
5Baoji Baoti Precision Forging Co., Ltd.1
6Jilin University1
7NANJING UNIV OF AERONAUTICS & ASTRONAUTICS1
#ApplicantPatent familiesShare
8TIANJIN UNIV OF TECH & EDUCATION (TEACHER DEV CENT…1
9Xi’an University of Architecture and Technology1
10Beijing Institute of Technology1
11Central South University1
12Zhongbei University1
13Xingtai University1
14Shenyang University of Technology1
↗ Hover a row · click a company to ask Eureka

RTX Corp’s lead, though modest in absolute terms, represents the only coherent multi-family industrial program in the field. For competitors, this means the defensive evidence snapshot is thin and freedom-to-operate is relatively open across most technical approaches.

The most recent filings (20252026) are subject to publication lag and likely undercount actual activity; the apparent acceleration should be read as a floor, not a ceiling. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Activity surged from 2022; AI computing methods dominate the technology mix

The filing trend and technology composition together reveal a field that ignited in 2022 and is still in its formative phase, with computational AI methods far outweighing downstream materials or manufacturing classes.

Annual filing trend

Zero filings were recorded from 2017 through 2021; activity began in 2022 and has grown each subsequent year through 2025. The 2025 and 2026 bars are subject to publication lag and should be treated as minimums. The overall trajectory is one of rapid ignition from a zero base rather than a maturing plateau.

Annual filing trendAnnual values from 2017 to 2026, peaking at 6 in 2025.02017020180201902020020212202232023320246202522026↗ Hover for values · click a bar to ask Eureka

Technology composition

G06N (Computing based on AI models) and G16C (Computational chemistry) are visible in the branch mix, reflecting a field focused on property prediction and materials informatics rather than process engineering. Alloy composition (C22C) and non-ferrous metal treatment (C22F) appear at much lower counts, confirming that the AI layer is largely disconnected from hands-on materials IP so far. Additive manufacturing (B33Y) and powder metallurgy (B22F) together represent a small but technically coherent cluster.

Technology compositionG06N · Computing based on AI models leads with 14; G16C · Computational chemistry 11.G06N · Computing based o…14G16C · Computational che…11G06F · Electric digital …10C22C · Alloys3C22F · Non-ferrous metal…3A61L · Sterilising & dis…2B33Y · Additive manufact…2G06T · Image data proces…2↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20250005806A1Published 2025-01-02

Generation of microstructural images of titanium a…

Rtx Corporation

The present disclosure provides for the generation of microstructural images of components (e.g., titanium alloys) using machine learning frameworks. More particularly, the present disclosure provides for the generation of microstructural images of components (e.g., titanium alloys) as a function of heat treatment conditions using conditional generative… (excerpt from the patent abstract)

Generation of microstructural images of titanium a… — patent drawingGeneration of microstructural images of titanium a… — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1一种基于机器学习的钛合金力学性能预测方法及装置14
2基于深度学习的增材制造镍钛合金件力学性能预测的方法2
3TC11钛合金厚壁管径锻工艺参数寻优方法1
4一种基于机器学习设计高温高强韧钛合金的方法及制备方法1
5一种基于热膨胀曲线进行机器学习的钛合金屈服强度预测方法1
6基于物理信息驱动的近β钛合金多性能预测方法1
7Generation of microstructural images of titanium a…1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · RTX Corp

RTX Corp

RTX Corp holds 3 patent families and is the only industrial organization with a multi-family program in this field. Its technical emphasis spans G06N (AI computing models), G06F (digital data processing), and G06T (image data processing and generation), pointing to a focus on AI-driven microstructure imaging and classification rather than alloy composition design. Momentum is classified as a new entrant, consistent with the field’s post-2022 ignition; its 3 recent families represent its entire portfolio here.

families: 3
Challenger · Sardar Beant Singh State University Gurdaspur

Sardar Beant Singh State University Gurdaspur

Sardar Beant Singh State University Gurdaspur holds 2 patent families and is the only academic institution with more than one family in the ranking. Its technical focus is concentrated in A61L (sterilizing and disinfecting, reflecting biomedical implant applications) and C22C (alloys), making it the sole filer with meaningful IP bridging AI methods and physical alloy composition in a biomedical context. Like RTX Corp, it is classified as a new entrant, with both families filed within the recent window.

families: 2
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
University of Science and Technology BeijingXi’an Jiaotong University+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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