TOPCon Module Encapsulation Patent Snapshot 2026
The documented patent evidence snapshot for TOPCon module encapsulation is extremely sparse, with a single patent family on record filed by one Chinese applicant in 2023. This nascent state indicates that dedicated encapsulation IP for TOPCon modules remains largely unclaimed, presenting a wide entry window for organizations with relevant materials and process expertise.
One applicant holds all documented IP in this nascent field
Ningbo Ouda Optoelectronics Co., Ltd. is the sole ranked applicant in this evidence snapshot, accounting for all documented activity with one patent family filed in 2023.
Concentration is absolute at this scale: the top five filers’ share of the ranked applicants visible in this query is 100%, though this reflects the extreme early-stage nature of the corpus rather than a genuine incumbent lock-in.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Ningbo Ouda Optoelectronics Co., Ltd. | 1 |
The single leader’s position implies an absence of competitive IP pressure; no established solar module maker, materials supplier, or encapsulant specialist has yet staked dedicated TOPCon encapsulation claims in the searchable record.
The most recent filing periods are subject to publication lag, so additional families filed in 2024–2025 may not yet appear in the corpus. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
A single 2023 filing event defines current activity; technology mix spans materials and semiconductor classes
The annual filing trend shows zero activity from 2017 through 2022, one family appearing in 2023, and no recorded filings thereafter. The technology composition reflects the multi-layer materials nature of module encapsulation.
Annual filing trend
All activity is concentrated in a single 2023 data point; zero filings appear in 2017–2022 and in 2024–2026. The 2024–2026 absence should be read cautiously given typical 18-month publication lag rather than as confirmed inactivity.
↗ Hover for values · click a bar to ask EurekaTechnology composition
The sole family touches four IPC branches equally: B29D (specific plastic articles), B32B (layered products and laminates), C09J (adhesives), and H01L (semiconductor devices). This spread is consistent with an encapsulant structure patent addressing both polymer processing and device-level integration.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
一种用于单双玻TOPcon组件聚烯烃封装膜及其制备方法
本发明涉及一种用于单双玻TOPcon组件聚烯烃封装膜，所述聚烯烃封装膜包括依次层叠的POE层、粘结层和EVA层；所述粘结层原料组成包括结构式I所示的超支化聚酰亚胺聚合物，其主链以三嗪结构为位点与聚酰亚胺链段连接，而支链则在三嗪结构上分别连接有PEG链段和聚硅氧烷链段；所述POE层、粘结层和EVA层中的至少一个膜层原料还包括功能助剂。本发明用于单双玻TOPcon组件聚烯烃封装膜，兼具POE和EVA材料优点，同时其兼具耐湿热老化和抗PID等性能，使其可满足单双玻TOPcon组件在长期恶劣条件下的封装性能要求。 (excerpt from the patent abstract)
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Ningbo Ouda Optoelectronics Co., Ltd.
The sole ranked applicant holds one patent family filed in 2023, classified across B29D, B32B, and C09J — indicating a materials-oriented encapsulation approach combining plastic forming, laminate layering, and adhesive chemistry. Applicant momentum is characterized as a new entrant, meaning no prior-period baseline exists for comparison.
families: 1No challenger identified
No second-ranked applicant exists in the current corpus. The challenger tier is vacant, underscoring the pre-competitive state of dedicated TOPCon module encapsulation IP. Organizations active in adjacent areas such as standard PV encapsulants or TOPCon cell processing have not yet filed in this specific niche.
families: N/AFrequently asked questions
The current corpus contains one patent family in scope, filed in 2023 by Ningbo Ouda Optoelectronics Co., Ltd. in China.
Ningbo Ouda Optoelectronics Co., Ltd. is the sole ranked applicant, holding one patent family. No other applicant appears in the ranking.
Only China appears in the jurisdiction data. No PCT, US, European, or other national-phase filings are recorded in the current corpus.
Four IPC branches appear, each with one record: B29D (specific plastic articles), B32B (layered products and laminates), C09J (adhesives), and H01L (semiconductor devices). This reflects the multi-material, device-integrated nature of module encapsulation.
No. Patent applications typically take 12–18 months to publish after filing. Any families filed in 2024 or 2025 may not yet appear in the searchable record, so the zero values for those years should not be interpreted as confirmed inactivity.
No co-applicant or joint-filing activity is recorded in the current corpus. The collaboration dataset is empty, meaning no university partnerships, cross-company joint filings, or research-institute co-inventorships have been documented for this specific topic.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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