Traction Inverter Interface Engineering Patent Landscape 2026
- Two families total. the searched intersection of thermal interface, die attach, sintered joint and busbar claims inside traction inverters is a thin, largely unfiled corner of power electronics.
- Filing has gone flat. activity peaked at a single filing in 2019 and the 2022 midpoint shows nothing, with no rebound visible through the most recent complete year.
- Every record filed through the US receiving office. with no counterpart filings surfaced elsewhere in this search, so jurisdictional coverage outside the US is untested by this evidence.
A narrow, sparsely filed intersection
The query sits at the intersection of two claim traditions: power conversion hardware under H02M and the packaging and interconnect detail that normally lives in H01L23/373 and H01L24. In this dataset, every record also carries an H05K assembly classification, meaning the two families found are being treated as printed-circuit-level assemblies as much as semiconductor packages. That is a narrow reading of the search string, and it is consistent with how thermal interface and die-attach claims for inverters tend to get written: as mechanical and thermal integration claims rather than materials-composition claims.
With only two published families against a search window that opens in 2015, this is not a mature or heavily contested claim space by the measure of this search. The scarcity itself is the finding: broad phrases like 'sintered joint' or 'busbar interconnect' combined with traction-inverter language turn up very little prior art, which is a different situation from the crowded thermal-management filing seen in adjacent EV battery packs.
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Filing trend and technology composition
The numbers below come directly from the searched corpus: two published families, both filed through the United States receiving office, with classification spread across power conversion and assembly subclasses.
Flat filing trend
Filings run at zero across most of the tracked window, with a single filing recorded in 2019 as the peak year so far. The 2022 midpoint shows zero, and the trend has not recovered into the most recently tracked years — bearing in mind that publication lag of roughly 18 months means the last one to two years are always undercounted at the point of any given data pull.
Two-subclass composition
Both records carry H02M (power conversion) and H05K (printed circuits and assemblies) classifications, with no spread into a broader set of subclasses. That concentration suggests examiners and applicants alike are filing this work as inverter-and-assembly claims rather than as standalone semiconductor-packaging claims, even though the search targeted H01L23/373 and H01L24 language directly.
Shares are the percentage of the 2 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Traction Inverter Interface Engineering with Eureka
This page is one run against one query. Ask Eureka your own question about traction inverter interface engineering and every answer comes back with the patent numbers behind it.
Try EurekaThe most-cited records in this set
Integrated mechanical and thermal design for power storage of a traction inverter
A traction inverter system includes a capacitor module, a power module, a cold plate between and in contact with the modules, and an end plate defining an inlet and outlet. The modules and plates define a bore spanning the modules and plates, and a passageway in fluid communication with the inlet and outlet. The traction inverter system also includes a mechanical fastener occupying the bore, spanning the modules and plates, and clamping the modules and plates together.This is the most-cited record in the set and the clearest articulation of a combined mechanical-clamping-plus-thermal-path claim structure for inverter modules.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US10707771B1 | Integrated mechanical and thermal design for power storage of a traction inverter | 11 |
| 2 | US20150138734A1 | 360 degree direct cooled power module | 8 |
Citation counts are drawn from within this searched corpus only and favour older filings; they signal historical influence on this niche, not current commercial weight.
Publication numbers are shown where the record carries one (2 of 2 rows); clicking a row searches Eureka by that number.
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Browse MCP servers →What the evidence actually supports
With only two families in scope, conclusions have to stay close to what is documented rather than extrapolate a trend line that isn't there.
A thin slice, not an empty one
Two families across an eleven-year search window means this specific combination of thermal-interface, die-attach and busbar language inside traction-inverter claims has barely been tested as a distinct filing category. That is different from saying the underlying engineering is rare — it more likely means most of that work is claimed under broader power-module or cooling-system language that this search string does not catch.
No sustained filing wave
The one year of recorded activity is 2019, and the trend has not repeated since — the 2022 midpoint is zero and there is no rebound visible through the latest tracked year. Treat the most recent one to two years as understated because of publication lag, but even allowing for that, there is no visible acceleration to explain away.
Assembly-level framing, not materials framing
Both families sit in power-conversion and printed-circuit-assembly subclasses rather than spreading into dedicated semiconductor-packaging subclasses. Anyone drafting new claims in this space should expect examiners to reach for inverter and assembly art first, not materials-composition art.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to traction inverter interface engineering, with the prior art for and against each one.
Who holds the filed art
Only two assignees appear in this ranking, and neither shows recent-year momentum in the dataset.
Ford Global Technologies, LLC
Holder of the most-cited record in the set, US10707771B1, which frames the inverter's thermal and mechanical integration as a single clamped assembly rather than separate thermal-interface and fastening claims. No new filings from this assignee appear in the latest tracked year.
Magna Electronics Systems
The second assignee in this ranking, holding the '360 degree direct cooled power module' record. Like Ford, it shows no recent-year filing activity in this search, consistent with the overall flat trend.
No long tail yet
With exactly two assignees accounting for both families, there is no long tail of single-filing entrants to speak of — the field is too small for that pattern to have formed. A new entrant filing a well-drafted claim here would not be crowding into a dense field; it would be one of only a handful of voices.
| Assignee | Recent year | YoY |
|---|---|---|
| Magna Electronics Systems | 0 | — |
| Ford Global Technologies, LLC | 0 | — |
Where to take this
The dataset is small enough that the next useful step is drafting against it directly, not waiting for more filings to accumulate.
Check freedom-to-operate against US10707771B1
This is the most-cited record in the set and covers a combined clamped-module, cold-plate and fastener-bore structure. Any inverter design using an integrated mechanical fastener as the thermal clamping path should be checked against its specific claim language.
Run a claim chart in Eureka →Draft into the under-claimed sub-areas
Sintered-joint busbar attach and double-side cooled die-attach interfaces show essentially no dedicated coverage in this search. A first-filed claim there starts from a much cleaner slate than most power-electronics sub-areas.
Explore white space in Eureka →Track the two active assignees for renewed filing
Both assignees show zero activity in the latest tracked year. A resumed filing from either would be the clearest signal that this niche is heating up again.
Set an assignee watch in Eureka →Questions practitioners ask about this space
In this searched dataset, only two patent families combine traction-inverter language with thermal interface material, die attach, sintered joint or busbar interconnect terms under the targeted IPC codes. That is a small number relative to power electronics generally, which suggests either the technology is usually claimed under broader power-module or cooling-system language, or that dedicated claims in this specific combination are genuinely rare. Either way, a narrow search like this should not be read as a full picture of all thermal-interface art touching inverters — only of this specific claim combination.
The trend is flat rather than growing. The single peak year recorded is 2019 with one filing, the 2022 midpoint shows zero, and there is no rebound through the latest tracked year. Because publication typically lags filing by around 18 months, the most recent one to two years in any patent trend are always undercounted, but even with that adjustment there is no visible growth signal here.
US10707771B1, assigned to Ford Global Technologies, LLC, claims a traction inverter assembly where a capacitor module, power module, cold plate and end plate are joined by a mechanical fastener that also defines part of the coolant flow path through a shared bore. It is the most-cited record in this set. Designs that use a single fastener structure to both clamp the module stack and route coolant should review this claim closely, since that combined mechanical-and-thermal function is the core of what is claimed.
Based on this search, sintered-joint busbar-to-substrate attach, double-side cooled die-attach interfaces, press-fit mechanical clamp thermal paths, and multi-material CTE-matched interface layers all show little to no dedicated coverage. That does not guarantee no prior art exists outside this exact search combination, but within it, these are the specific sub-areas without a filed claim occupying the space. A first mover drafting narrowly around one of these mechanisms would be filing into largely open territory by this evidence.
This dataset surfaces exactly two assignees: Ford Global Technologies, LLC, which holds the most-cited record on integrated mechanical and thermal design, and Magna Electronics Systems, which holds a record on a 360-degree direct-cooled power module. Neither assignee shows filing activity in the latest tracked year, so neither can currently be described as actively expanding its position in this specific claim combination. A resumed filing from either, or a new entrant, would be the signal to watch for.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.