Traction Inverter Power Module Patent Snapshot
The traction inverter power module patent space is nascent, with only 3 patent families on record held by three distinct applicants — Desivog Holdings, Audi AG, and Amulaire Thermal Technology — each with equal standing. Filing activity is in a growth stage, with recent-year data still subject to publication lag.
Three applicants share the field equally — no dominant incumbent yet
The corpus covers 3 patent families across three applicants: Desivog Holdings, Audi AG, and Amulaire Thermal Technology, each holding 1 patent family. No single player commands a majority position.
The top five filers account for 100% of the ranked applicants visible in this query’ combined total, reflecting an extremely concentrated but small field where no applicant has yet established a meaningful lead over peers.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Desivog Holdings Limited | 1 | |
| 2 | Audi AG | 1 | |
| 3 | Amulaire Thermal Technology Inc | 1 |
The equal distribution among an automotive OEM (Audi AG), a thermal-technology specialist (Amulaire Thermal Technology), and an electronics holding company (Desivog Holdings) signals that no incumbent has locked down the space — early movers with targeted IP strategies retain a genuine first-mover opportunity.
Recent filing years are subject to publication lag of approximately 18–24 months; the apparent absence of activity in 2025–2026 should not be read as a pause in industry interest. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Sporadic filing pattern with semiconductor thermal management as the core technology
The annual filing trend and IPC composition together reveal where current technical effort is concentrated and where adjacent branches remain relatively sparse.
Annual filing trend
Filings appeared in 2020, 2023, and 2024, with no activity in intervening years — reflecting a very early-stage corpus. The lifecycle assessment classifies this field as Growth; 2025 and 2026 data are understated due to publication lag and should not be interpreted as a slowdown.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H01L (semiconductor devices) is the visible branch, covering all 3 families, followed by H05K (printed circuits and assemblies) and H10W, each covering 2 families. F28F (heat-exchanger details) and H02M (power conversion) each appear in 1 family, indicating that thermal management integration and power-conversion electronics are secondary but present themes.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Molded power module with integrated exciter circuit
A power module for electric drives is provided which comprises at least one exciter circuit with at least one power semiconductor, wherein the power module is molded and the exciter circuit with the at least one power semiconductor is integrated in the molded power module. A traction inverter is also provided which comprises a water-cooled main cooler… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | 用于传动系至少两个电子功率模块的冷却装置和冷却系统 | 2 |
| 2 | Vehicle water-cooling heat sink plate having fin s… | 1 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Desivog Holdings
Desivog Holdings holds 1 patent family with a technology focus on H01L 23 (semiconductor devices) and H10W 40. Momentum is classified as a new entrant, indicating this is a recent first filing with no prior-period baseline. The combination of semiconductor-device and wide-bandgap-adjacent IPC classes suggests an interest in the module-level integration of power semiconductors.
families: 1Audi AG
Audi AG holds 1 patent family with emphasis on H01L 23 (semiconductor devices), H02M 1, and H02M 7 (power conversion). As an automotive OEM, Audi’s focus on power-conversion IPC classes points to system-level inverter integration rather than pure component design. Applicant momentum data for Audi is not separately reported in the corpus.
families: 1Frequently asked questions
The current corpus contains 3 patent families. This is a very early-stage field, and recent years are likely understated due to publication lag.
Three applicants hold 1 patent family each: Desivog Holdings, Audi AG, and Amulaire Thermal Technology. No single applicant currently leads by volume.
H01L (semiconductor devices) is the most common IPC class, covering all 3 families. H05K (printed circuits and assemblies) and H10W each cover 2 families. F28F (heat-exchanger details) and H02M (power conversion) each appear in 1 family.
The corpus spans China, Europe (EPO), and the United States, with one filing record in each jurisdiction. China is the leading filing office by record count.
The lifecycle stage is classified as Growth, with annual filings still rising. Filing events occurred in 2020, 2023, and 2024. Data for 2025 and 2026 are understated due to publication lag and should not be read as a slowdown.
No co-applicant relationships are present in the current corpus. All three applicants file independently, consistent with the very early stage of the field.
Ready to map your own traction inverter power module Snapshot?
Join 18,000+ innovators using PatSnap Eureka to map any technology landscape: search 2B+ patents and papers, surface key assignees, and generate a report like this in minutes.
Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.