2D Material Dry Transfer Patents: Who Leads, Where Gaps Are 2026
- Concentrated but not closed: the top 5 assignees hold 62.8% of the 43 records in scope, yet a leader with only 10 filings sits atop a field with no dominant incumbent.
- Filing kept climbing through 2024: filings rose 25% from 2021 (4) to 2024 (5), the last year the dataset treats as complete — 2025-26 counts will still fill in.
- Claims cluster in semiconductor devices: H01L and H10D together touch over half the record set, while measurement (G01N) and cleaning/removal (C25F) classes remain comparatively thin.
Filing growth compares 2021 (4 records) with 2024 (5) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 43 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
Dry transfer techniques move an atomically thin layer — graphene, MoS2 or a related 2D material — from its growth substrate onto a target substrate without a liquid intermediary, preserving crystal quality and interface cleanliness. This matters for device integration: every downstream step, from heterostructure stacking to contact deposition, inherits whatever defects or contamination the transfer step introduces. The 43 records in scope span carrier-stack methods, multiferroic-layer integration, and lateral heterojunction formation, filed mainly through the United States, WIPO and European receiving offices.
The field reads as academically driven rather than consolidated around a single commercial leader: university and government research assignees appear repeatedly in the ranked leaders, and the most-cited records concentrate around multiferroic-layer integration work rather than transfer hardware itself. That split — high citation weight on integration physics, lower density on the mechanical transfer step — is where a freedom-to-operate review should start.
Filing trend and technology composition
Two views of the same 43-record set: how filing activity moved year over year, and which IPC subclasses carry the claim volume.
Filing trend, 2017-2026
Filings ran from 8 in 2017 to a peak of 9 in 2020, then eased before climbing again to 5 in 2024 — a 25% rise from the 4 filed in 2021. 2025 and 2026 show as thin because publication lags filing by roughly 18 months; those years are not evidence of a slowdown.
IPC subclass composition
H01L (semiconductor devices) touches 55.8% of the 43 records, with H10D close behind the general semiconductor-device grouping at 25.6%. G01N (material analysis & testing) sits at 23.3%, and niche classes like C25F (electrolytic removal & cleaning) at 7.0% show where fewer claims have been staked. Records can carry more than one class, so these shares sum above 100%.
Shares are the percentage of the 43 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Two-Dimensional Materials — Dry Transfer of Two-Dimensional Materials Patent Landscape with Eureka
This page is one run against one query. Ask Eureka your own question about two-dimensional materials — dry transfer of two-dimensional materials patent landscape and every answer comes back with the patent numbers behind it.
Try EurekaA recent claim worth reading in full
WO2025014364A1 — Carrier stack for transferring a 2D material to a target substrate
A carrier stack for transferring a two-dimensional, 2D, material layer to a rigid target substrate and a method of producing the stack, the method including: providing a rigid or semi-rigid carrier substrate; coating at least one of the carrier substrate and the 2D material layer with an adhesion layer; and bonding the 2D material layer to the carrier substrate through the at least one adhesion layer, with the carrier substrate positioned facing the 2D material layer while the 2D material layer is supported by a growth substrate.Filed by Applied Nanolayers B.V., this record claims the carrier-stack and adhesion-layer combination rather than the 2D material itself — the distinction that matters for anyone designing a competing transfer process.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20180158955A1 | Controlling structural phase transitions and properties of two-dimensional materials by integrating with mult… | 24 |
| 2 | US20180158934A1 | Lateral heterojunctions in two-dimensional materials integrated with multiferroic layers | 23 |
| 3 | WO2018094397A1 | Two-dimensional materials integrated with multiferroic layers | 16 |
| 4 | US20200027921A1 | Nearly 2d electronic microparticles | 13 |
| 5 | WO2019006044A1 | Nearly 2d electronic microparticles | 9 |
| 6 | US10403753B2 | Controlling structural phase transitions and properties of two-dimensional materials by integrating with mult… | 8 |
| 7 | US20210408372A1 | Non-volatile resistance switching in monoslayer atomic sheets | 6 |
| 8 | US11121176B2 | Nearly 2D electronic microparticles | 6 |
| 9 | US20240332017A1 | Liquid metal printed 2d ultrahigh mobility conducting oxide transistors | 2 |
| 10 | US20210109054A1 | Illuminated ultra-thin chemical sensors, and systems and methods comprising same | 2 |
Citation counts favour older filings that have had more time to accumulate cites; treat them as a signal of influence within this corpus, not a ranking of current importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Four readings of the same 43-record dataset, each pointed at a different decision a reader might need to make.
A shallow leadership tier, not a monopoly
The leading assignee holds 10 of the 43 records; fifth place holds only 3. That gap between first and fifth means no single filer controls the field's direction, but it also means a newcomer's freedom-to-operate review has to clear several mid-sized portfolios rather than one dominant one.
Activity is rising into the most recent complete year
Filings grew from 4 in 2021 to 5 in 2024, the last year the dataset can treat as complete. Combined with 2025-26 records still arriving through the publication lag, the underlying trend reads as sustained rather than cooling.
Semiconductor-device claims dominate the class mix
H01L and its H10D counterpart together cover more than half the record set, showing that most filers are claiming transfer methods as part of a device-integration story rather than as a standalone process patent. G01N appears in under a quarter of records, leaving characterization and QC methods comparatively open.
Filing activity is US-centred with a PCT tail
The United States receives the largest share of filings at 24, with WIPO's PCT route carrying 8 and Europe 5. China and South Korea each show a single filing in this dataset, suggesting the documented activity has not yet broadened into those jurisdictions at scale.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to two-dimensional materials — dry transfer of two-dimensional materials patent landscape, with the prior art for and against each one.
Assignees and where the claim space still opens up
The ranked leaders are academic and government research bodies more often than device manufacturers, which shapes both the citation pattern and the kind of claims worth watching.
A research-heavy top of the ranking
The top-ranked assignee holds 10 of the 43 records in scope. University and government research bodies recur through the ranked leaders, pointing to a field still generating foundational integration patents rather than settled manufacturing IP.
A tight cluster below the leader
Filings drop from 10 at the top to 3 by fifth place, and to 1 by tenth — a steep taper rather than a plateau. That shape favours filers who move early on a specific transfer mechanism over those trying to out-file an incumbent.
Co-filing stays within a small circle
Ten co-assignee pairs appear in the dataset, with the strongest recurring pairing tied to the same lead inventor across three separate collaborations. This suggests transfer-method research clusters around specific lab groups rather than spreading across many independent teams.
| Assignee | Recent year | YoY |
|---|---|---|
| The Government of the United States of America, as represented by the Secretary of Health and Human Services | 0 | — |
| Regents of the University of Minnesota | 0 | — |
| Board of Regents of the University of Texas System | 0 | — |
| Massachusetts Institute of Technology | 0 | — |
| Trustees of Dartmouth College | 0 | — |
| VANTERVE OLAF M J | 0 | — |
| MCCREARY KATHLEEN M | 0 | — |
| LI CONNIE H | 0 | — |
Where to take this analysis
The landscape points to specific next steps rather than a single verdict on the field.
Run a freedom-to-operate check against the mid-tier
With the top 5 assignees holding 62.8% of records and the rest spread thin, a new filing needs clearance against several mid-sized portfolios, not just the leader.
Explore assignee portfolios in EurekaTrack the H10B and C25F classes for early movers
Memory-device integration and electrolytic cleaning methods carry lower filing density than the H01L core, making them worth monitoring for early claims before they crowd.
Set up class-level alerts in EurekaWatch the 2025-26 filing years as they backfill
Publication lag means the most recent two years understate real activity; revisit the trend once those cohorts settle.
Monitor filing trends in EurekaCommon questions on this landscape
Within this 43-record dataset, the leading assignee holds 10 records, with the field then tapering quickly to 3 records at fifth place and 1 at tenth. The ranked leaders skew toward university and government research institutions rather than device manufacturers, which reflects the field's early-stage, integration-focused research character. No single filer holds a dominant share large enough to be called a gatekeeper, so freedom-to-operate work needs to check several mid-sized portfolios rather than one leader.
Filings rose 25% from 4 in 2021 to 5 in 2024, the most recent year the dataset treats as complete. The peak single year so far is 2020 at 9 filings. Counts for 2025 and 2026 appear low, but that reflects the roughly 18-month lag between filing and publication rather than an actual drop in activity — those years will keep filling in as more records publish.
Semiconductor-device classes dominate: H01L appears in 55.8% of the 43 records and H10D in 25.6%, meaning most filers frame transfer methods as part of a device-integration claim rather than a standalone process. Material analysis and testing (G01N) covers 23.3% of records, while niche areas like electrolytic removal and cleaning (C25F) sit at just 7.0%, marking where claim space remains comparatively open.
WO2025014364A1, filed by Applied Nanolayers B.V. and published in 2025, claims a carrier stack and bonding method for transferring a 2D material layer onto a rigid target substrate using an adhesion layer. The claims centre on the carrier-stack architecture and the adhesion-layer bonding sequence, not on the 2D material itself, so it constrains a specific mechanical transfer route rather than 2D-material use broadly. Anyone designing a competing carrier-stack or adhesion-layer approach should read the full claim set before proceeding.
The clearest gaps sit in classes with lower filing density relative to the H01L core: material characterization methods during transfer (G01N sits at 23.3% versus H01L's 55.8%), electrolytic delamination and cleaning (C25F at 7.0%), and memory-device-specific transfer integration (H10B at 11.6%). These are areas where the core mechanical transfer concept has been claimed less densely than the semiconductor-device integration that surrounds it, leaving room for narrowly drafted first claims.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.