2D Materials Patents: Top Companies & Filing Trends 2026
- 25.3% concentration at the top. The five most active assignees combined account for 241 of the 953 records in scope — a leadership cluster, not a single dominant filer.
- Filings grew 70% from 2021 to 2024. From 30 records in 2021 to 51 in 2024, the clearest complete-year growth signal in the dataset; 2025 and later are still filling in due to publication lag.
- Semiconductor and implant classes lead, but neither dominates. H01L (12.3%) and A61F (12.0%) of the 953 records top the IPC composition, with coating, inorganic compounds and materials testing close behind.
Filing growth compares 2021 (30 records) with 2024 (51) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 953 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This landscape draws on 953 published records filed or published between 2015 and the August 2026 data cut-off, matched against claim and description text referencing two-dimensional materials, layered materials, and associated material property, synthesis condition, and characterization data language. The scope is deliberately broad across application domains: semiconductor devices, surface coatings, implants, nonwovens and measurement instrumentation all appear in the technology composition, reflecting how layered-material claims have spread from pure materials science into adjacent manufacturing and medical fields.
Because publication lags filing by roughly 18 months, the 2025-2026 filing counts in this dataset are necessarily incomplete and should not be read as a slowdown. The most reliable recent signal is the 2021-2024 span, where filings rose from 30 to 51 records a year.
Filing trends and technology composition
Two views of the same 953-record dataset: filing activity by year, and the IPC subclasses those records fall into. Because a single record can carry several IPC classes, the composition shares add up to more than 100% of the record total.
A growth phase visible before the reporting lag sets in
Annual filings climbed from 66 records in 2017 to a peak of 81 in 2019, dipped, then resumed climbing through the 2021-2024 window (30 to 51 records, +70%). The 2026 figure of 6 reflects only what has published so far this year, not an actual drop in filing activity.
Claims spread across eight core subclasses
H01L (semiconductor devices, 12.3% of the 953 records) and A61F (implants and prostheses, 12.0%) are the two largest subclasses, followed by C23C coating and surface deposition (10.1%) and C01B non-metallic elements and inorganic compounds (9.5%). G01N material analysis, B32B layered products, D04H nonwovens and G01B measurement round out the top eight, none individually exceeding 7.3% of records.
Shares are the percentage of the 953 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Two-Dimensional Materials Patent Landscape with Eureka
This page is one run against one query. Ask Eureka your own question about two-dimensional materials patent landscape and every answer comes back with the patent numbers behind it.
Try EurekaMost-cited records and a representative filing
US11745252B2 — Method of producing a magnesium alloy wheel hub
The patent describes a forging process for magnesium alloy wheel hubs: heating a magnesium alloy bar to 350-430°C, a two-stage forging sequence at specified press speeds, and a step that tests the microstructure and material properties of the forged blank to obtain the layered material property distribution across its thickness before final processing.Filed by CITIC DICASTAL CO., LTD., granted 2023-09-05. Its relevance to this landscape is the layered material property distribution step, which ties a conventional forging process to the characterization-data language the search scope targets.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20180105930A1 | Method for manufacturing two-dimensional transition metal dichalcogemide thin film | 501 |
| 2 | US20110263115A1 | NMOS metal gate materials, manufacturing methods, and equipment using CVD and ALD processes with metal based … | 491 |
| 3 | US20130211531A1 | Patient-adapted and improved articular implants, designs and related guide tools | 461 |
| 4 | US20160085003A1 | Materials, components, and methods for use with extreme ultraviolet radiation in lithography and other applic… | 434 |
| 5 | US20120209394A1 | Patient-Adapted and Improved Articular Implants, Designs and Related Guide Tools | 378 |
| 6 | US20120141799A1 | Film on Graphene on a Substrate and Method and Devices Therefor | 347 |
| 7 | US20060094320A1 | Gradient nanofiber materials and methods for making same | 295 |
| 8 | US20140228860A1 | Automated Design, Selection, Manufacturing and Implantation of Patient-Adapted and Improved Articular Implant… | 252 |
| 9 | US20140086780A1 | Methods and systems for optimizing design and manufacture of implant components using solid freeform fabricat… | 251 |
| 10 | US9020788B2 | Patient-adapted and improved articular implants, designs and related guide tools | 214 |
Citation counts favour older records simply because they have had more time to be cited; treat them as a signal of influence within this corpus, not as a ranking of current technical importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Three findings that shape where new claims are likely to clear examination and where they are likely to collide with dense prior art.
Leadership is real but not singular
The five most active assignees combined account for a quarter of all records in scope, with the leader at 75 records against a fifth-place figure of 29. That gap between first and fifth suggests one filer built an early, sustained position while a cluster of others followed at a materially lower pace.
The growth phase is recent and still underreported
Filing activity nearly doubled through the most recent complete-year window available. Because publication lags filing by about 18 months, the true 2025-2026 filing volume is almost certainly higher than the 6-record 2026 figure currently shows.
No single application dominates the claim space
Semiconductor devices and implants lead the IPC composition by a narrow margin, but coating and deposition, inorganic compounds, and materials testing each account for meaningful shares too. That spread signals a materials platform being claimed across several downstream industries rather than one settled application.
US filings dominate the venue mix
The United States receives more than twice as many filings as the next office (WIPO/PCT), with Europe, the UK, Australia and India trailing further behind. A filer building a defensive position outside the US should expect thinner prior art in the smaller offices.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to two-dimensional materials patent landscape, with the prior art for and against each one.
Who is filing, and where activity has gone quiet
The ranked leaders span materials science, medical implants and industrial tooling — a sign that two-dimensional and layered-material claims cut across sectors rather than sitting inside one industry group.
One filer with a clear lead
The top assignee's 75 records sit well ahead of the fifth-place figure of 29, indicating a sustained, deliberate filing programme rather than opportunistic single filings.
A dense mid-tier below the top five
The tenth-place assignee still holds 22 records, meaning the top 10 combined reach 359 records (37.7% of the 953 in scope) — a wide base of active filers rather than a narrow race.
Recent-year activity has thinned across established names
Several previously active assignees show zero filings in the latest year, including one with a -100% year-on-year change. Only one tracked assignee logged a filing in the most recent year, though the publication lag means this understates true recent activity.
| Assignee | Recent year | YoY |
|---|---|---|
| CAMOPLASY INC | 1 | — |
| Kimberly-Clark Worldwide, Inc. | 0 | -100% |
| Paragraf Ltd | 0 | — |
| JENTEK SENSORS INC | 0 | — |
| ConforMIS, Inc. | 0 | — |
| The Regents of the University of California | 0 | — |
| Massachusetts Institute of Technology | 0 | — |
| Avery Dennison Corporation | 0 | — |
Where to take this analysis
The dataset points to a field still expanding across application domains, with the recent-year numbers understated by publication lag. The next steps depend on whether the goal is defensive clearance or identifying open claim space.
Check freedom-to-operate against the top 10 assignees
With 37.7% of all 953 records held by ten assignees, any new filing in H01L or A61F territory should be checked against their specific claim scope before drafting.
Explore assignee claims in EurekaWatch the 2021-2024 growth cohort for renewed activity
The +70% three-year growth rate suggests new entrants may still be filing; the thinner 2025-2026 counts likely reflect lag rather than a real slowdown.
Track filing momentum in EurekaTest claim language in the under-claimed sub-areas
Coating adhesion, in-situ characterization and inorganic synthesis routes show thinner density than the core semiconductor cluster and may offer clearer claim space.
Draft and test claims in EurekaCommon questions about this landscape
The ranked leaders span materials science institutions, medical implant makers and industrial tooling companies rather than a single dominant sector. The top assignee holds 75 records in this dataset, with the next four combined bringing the top-five total to 241 records, or 25.3% of the 953 records in scope. That gap between first place and the rest suggests one organisation has run a longer, more deliberate filing programme, while a broader group of active filers sits just behind it — the top 10 together reach 37.7% of all records, so no single company controls the field.
It is growing, based on the most reliable complete-year data available. Annual filings rose from 30 records in 2021 to 51 in 2024, a 70% increase over that three-year span. The apparent drop-off in 2025 and 2026 is a publication-lag artefact — patents typically publish around 18 months after filing, so the most recent one to two years in any dataset will always look artificially low and should not be read as declining interest.
Semiconductor devices (H01L) and implants or prostheses (A61F) are the two largest IPC subclasses, each covering roughly 12% of the 953 records in scope. Coating and surface deposition, non-metallic inorganic compounds, materials testing, layered laminates, nonwovens and dimensional measurement all follow closely behind, each exceeding 6% of records. Because a single patent can be classified under multiple subclasses, these shares add up to more than 100%, and the spread indicates the technology is being claimed across several downstream industries rather than converging on one dominant use case.
The IPC composition shows several subclasses with meaningfully lower filing density than the semiconductor and implant clusters, including nonwoven layered composites, in-situ characterization instrumentation, and inorganic synthesis routes for 2D precursors. Lower density in the data does not guarantee an easy grant, but it does indicate less crowded claim territory relative to the H01L and A61F clusters. Anyone evaluating a new filing should still run a full freedom-to-operate check against the specific claims of the ranked leaders before assuming a subclass is open.
US11745252B2 is a CITIC DICASTAL patent on a magnesium alloy wheel hub forging process, granted in September 2023. Its claims are specific to a forging sequence — heating temperature range, two-stage forging speeds, and a step that measures the layered material property distribution across the thickness of the forged blank. It appears in this dataset because that characterization step matches the search scope's language, but its claims are narrowly tied to wheel hub manufacturing and would not block unrelated two-dimensional materials synthesis or device work.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.