Two-Phase Cooling Patents: Top Companies & Filing Trends 2026
- 59.3% of all 86 records sit with just five assignees — filing here means measuring your claims against a concentrated top, not a diffuse field.
- Filings peaked in 2023 at 10 and have not exceeded that since, with the 2022 midpoint at 9 records — momentum looks flat rather than accelerating.
- H05K and F28D dominate at 58.1% and 54.7% of records respectively, while dielectric-fluid and refrigeration-adjacent classes stay under 8%.
What this dataset covers
Two-phase cooling routes heat away from power electronics by letting a dielectric fluid change state — boiling at the die or heat-sink surface and condensing elsewhere in the loop. The 86 records in scope span microchannel evaporators, pumpless loops and forced-vapor systems, filed against critical heat flux, flow instability and dielectric fluid selection as the search’s defining technical criteria. The scope intentionally excludes single-phase liquid cooling and air-cooling claims that do not address a phase-change mechanism.
Filing office data shows the United States drawing the largest share of these records, with the EPO, PCT (WIPO) and other jurisdictions trailing well behind — consistent with a field still anchored in data centre and server hardware developed close to US design teams.
Filing trend and technology composition
Two views of the same 86-record dataset: how filing activity has moved year over year, and which IPC subclasses the claims actually sit in.
A flat-to-declining curve after 2023
Filings rose from 4 in 2017 to a peak of 10 in 2023, with 2022 sitting at 9 — the midpoint shows growth had already levelled off before the peak year, and the most recent year is undercounted because publication lags filing by roughly 18 months.
Claims concentrate in circuit assemblies and heat exchange
H05K (printed circuits & assemblies) and F28D (heat-exchange apparatus) each cover more than half of the 86 records, with H01L (semiconductor devices) close behind at 45.3%. Dielectric-chemistry-adjacent classes like C01G and cooling-specific F25D each sit at or under 7%, a much thinner layer of claim activity than the mechanical and packaging classes above them.
Shares are the percentage of the 86 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Two-Phase Cooling for Power Electronics with Eureka
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Try EurekaThe most-cited records in this space
Flexible two-phase cooling system
A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant.Filed by Ebullient, Inc., granted December 2017 — a useful reference point for how server-rack two-phase loops were being claimed before the current filing plateau.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20160120059A1 | Two-phase cooling system | 137 |
| 2 | US6903929B2 | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink | 113 |
| 3 | US8194406B2 | Apparatus and method with forced coolant vapor movement for facilitating two-phase cooling of an electronic d… | 96 |
| 4 | US20040190251A1 | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink | 89 |
| 5 | US20040190253A1 | Channeled heat sink and chassis with integrated heat rejector for two-phase cooling | 67 |
| 6 | US20130340978A1 | Two-phase cooling system for electronic components | 64 |
| 7 | US20160120058A1 | Fluid distribution unit for two-phase cooling system | 57 |
| 8 | US20110069453A1 | Apparatus and method with forced coolant vapor movement for facilitating two-phase cooling of an electronic d… | 54 |
| 9 | US20150351290A1 | Method of absorbing sensible and latent heat with series-connected heat sinks | 44 |
| 10 | US20160216042A1 | High performance two-phase cooling apparatus | 39 |
Citation counts favour older filings that have had more time to accumulate references — read them as a signal of influence on the field, not of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the filing pattern tells you
Three read-outs from the trend, the concentration figures and the IPC composition, aimed at where to spend diligence time.
The top of the field is tight
Just five assignees account for the majority of records in scope, and the top ten push that to 83.7% of all 86 records. A new entrant is filing into a space where the leading players have already staked most of the claim territory.
Growth has flattened, not accelerated
The midpoint year, 2022, already sat at 9 filings — one below the eventual peak. Several previously active assignees show zero filings in the most recent year, though that figure is softened by publication lag.
Packaging claims outweigh fluid chemistry
H05K and F28D together cover the large majority of records, while dielectric-fluid-adjacent classes like C01G sit at just 7.0%. The mechanical and thermal-interface layer is far more heavily claimed than the coolant chemistry itself.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to two-phase cooling for power electronics, with the prior art for and against each one.
Who is filing, and where the activity has cooled
The ranking covers 22 companies returned by the data endpoint — not a top-50 or top-100 list, just the assignees with filings in scope. The leader holds 14 records; fifth place holds 7; tenth place holds 3, a steep drop-off from the top of the table.
A clear leader, then a fast taper
The gap between the leader's 14 records and the tenth-ranked assignee's 3 shows a field with one dominant filer rather than several evenly matched competitors.
Several named filers have gone quiet
Assignees including Ebullient, PIMEMS, Samsung Electronics, IBM and Wieland Provides all show zero filings in the most recent year tracked — consistent with the field's flat post-2023 trend, though recency is understated by publication lag.
Co-filing is rare in this dataset
Only two co-assignee pairings appear across the 86 records, the strongest being a four-record pairing between individual inventors rather than corporate co-development — most filings here are single-assignee efforts.
| Assignee | Recent year | YoY |
|---|---|---|
| EBULLIENT | 0 | — |
| PIMEMS INC | 0 | — |
| Samsung Electronics Co., Ltd. | 0 | — |
| International Business Machines Corporation (IBM) | 0 | — |
| WIELAND PROVIDES SRL | 0 | — |
| PRASHER RAVI | 0 | — |
| MAHAJAN RAVI | 0 | — |
| MEINHART CARL | 0 | — |
Where to take this analysis
The figures above describe the field as it stands; the next layer of work is claim-level and forward-looking.
Map claims against the concentrated top 5
With 59.3% of records held by five assignees, a freedom-to-operate check should start there before broadening to the long tail.
Run a claim comparison in EurekaWatch the under-claimed branches
Dielectric fluid selection and pumpless loop control sit well below the H05K/F28D core in filing density — worth monitoring for new entrants.
Track white space in EurekaCommon questions on two-phase cooling patents
Within the 86 records in scope, one assignee leads with 14 filings, well ahead of the fifth-ranked assignee at 7 and the tenth-ranked at 3. The top five assignees together account for 59.3% of all records, and the top ten reach 83.7%, so the field is concentrated at the top with a long tail of smaller filers below. Anyone entering this space should expect to negotiate around a small number of established portfolios rather than a fragmented crowd of equal-sized competitors.
Filings rose from 4 in 2017 to a peak of 10 in 2023, but the 2022 figure of 9 shows growth had already nearly plateaued before that peak. Several previously active assignees show zero filings in the most recent tracked year. Because publication typically lags filing by around 18 months, the most recent year understates true activity, but the overall shape of the curve is flat rather than accelerating.
The dataset's records sit mainly across H05K (printed circuits and assemblies, 58.1% of records), F28D (heat-exchange apparatus, 54.7%) and H01L (semiconductor devices, 45.3%). Because a single record can carry several IPC classes, these shares add up to more than 100%, which is expected. Narrower classes tied to dielectric fluid chemistry and refrigeration, such as C01G and F25D, cover under 8% of records each, marking them as comparatively under-claimed.
US9854715B2, assigned to Ebullient, Inc. and granted in December 2017, covers a flexible two-phase cooling apparatus built around a primary cooling loop with two bypasses, flexible cooling lines routable inside server housings, and series-connected heat sink modules mounted on microprocessors. The claims center on transporting low-pressure, two-phase dielectric coolant through routable lines rather than fixed piping. Anyone designing a server-rack two-phase loop with flexible, reconfigurable coolant routing should review this filing's specific claim language before finalizing a design.
The technology composition data shows dielectric fluid selection criteria, pumpless loop control logic and refrigerant-adjacent phase-change approaches all sitting at low single-digit shares of the 86 records, well below the dominant H05K and F28D packaging classes. Combined with only two identified co-assignee pairings in the whole dataset, there is limited evidence of dense collaborative filing in these adjacent areas. That combination — low record density plus little co-filing — is what marks these branches as comparatively open for new claims.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.