https://www.patsnap.com/resources/blog/rd-blog/ultrafast-and-femtosecond-lasers-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Photonics & Lasers
Ultrafast and Femtosecond Laser Patents: Filing Trends and Who Leads
  • Filing has cooled since 2020. annual filings peaked at 75 in 2020 and have declined since, with 2026 still partial at 3 — a maturing claim landscape rather than a growing one.
  • Two IPC subclasses dominate almost evenly. H01S (lasers and stimulated emission) and B23K (welding, soldering and brazing) each cover roughly half of the corpus, showing the field splits between source physics and materials-processing application.
  • The US receives nearly double any other office. 456 filings route through the United States versus 198 in China and 181 at the EPO, indicating where enforcement risk concentrates first.
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1,215
Published Records
20%
Top-5 Share of All Records
-44%
3-Yr Growth (lag-adjusted)
US
Leading Jurisdiction
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the ultrafast and femtosecond laser patent corpus covers

Ultrafast and femtosecond laser patents span two distinct engineering problems: generating and controlling pulses of extremely short duration, and applying those pulses to cut, weld, dice or reshape materials with minimal thermal damage. The search corpus captures both sides through the IPC split between H01S (laser sources and stimulated emission) and B23K (welding, soldering and cutting), with G02B and G02F covering the optical control layer in between. Medical and semiconductor applications — A61F, A61B, H01L — appear as smaller but persistent downstream branches.

The 1,215 families in this dataset span filings from 2017 through mid-2026, with the most recent year understated because publication typically lags filing by around 18 months. Reading the trend requires treating the last one to two years as a floor, not a ceiling.

Annual filings, 2017-2026 (2026 partial)
  1. 1ROFIN SINAR TECH LLC65
  2. 2ALCON INC56
  3. 3CYNOSURE INC45
  4. 4ALCON LENSX INC40
  5. 5IMRA AMERICA INC35
  6. 6BOARD OF TRUSTEES OPERATING MICHIGAN STATE UNIV32
  7. 7BOEGLI GRAVURES SA30
  8. 8PANASONIC HOLDINGS CORP30
  9. 9CENT NAT DE LA RECH SCI (C N R S)29
  10. 10IPG PHOTONICS CORP24
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Ultrafast and Femtosecond Lasers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Filing Data

Filing trend and technology composition

The dataset's filing curve and IPC distribution together describe a field that expanded through the late 2010s, peaked in 2020, and has since settled into a slower filing rhythm concentrated around two core application areas.

A peak-and-decline filing curve

Filings rose from 50 in 2017 to a peak of 75 in 2020, then eased back toward the midpoint of 42 in 2022. That pattern is more consistent with a technology whose core claim space has been substantially staked out than with one still in an early land-grab phase.

A peak-and-decline filing curve020406080502017201820197520202021202220232024202532026Most recent year is partial — publication lag means later filings are not yet visible.

Two nearly equal application clusters

H01S (607 records) and B23K (595 records) sit almost level, meaning source-side innovation and materials-processing innovation are filed at comparable rates. G02B and G02F, each in the 140-150 range, mark the optical-control layer connecting the two; A61F, H01L, A61B and C03B show the field's reach into implants, semiconductors, surgery and glass forming.

Two nearly equal application clustersH01S · Lasers & stimulated emission60750.0%B23K · Welding, soldering & brazing59549.0%G02B · Optical elements & systems15112.4%G02F · Optical control & modulation14111.6%A61F · Implants & prostheses857.0%H01L · Semiconductor devices685.6%A61B · Diagnosis & surgery594.9%C03B · Glass manufacture & shaping584.8%Other73960.8%

Shares are the percentage of the 1,215 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Ultrafast and Femtosecond Lasers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on Ultrafast and Femtosecond Lasers with Eureka

This page is one run against one query. Ask Eureka your own question about ultrafast and femtosecond lasers and every answer comes back with the patent numbers behind it.

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Key Patents

The most-cited prior art in ultrafast laser processing

Representative Filing
US20140092927A12014-04-03

Femtosecond laser processing system with process parameters, controls and feedback (IMRA America)

IMRA AMERICA, INC.

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.Filed by IMRA America, published 2014-04-03. Its claim scope over integrated feedback-controlled femtosecond processing systems is a recurring reference point for later filers in this space.

US20140092927A1 — patent drawing 1US20140092927A1 — patent drawing 2
View full filing details
Highest-citation records in the corpus
#Publication no.Patent titleCitations
1US5400350AMethod and apparatus for generating high energy ultrashort pulses377
2US6552301B2Burst-ultrafast laser machining method306
3US20050274702A1Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser275
4US20010009250A1Burst-ultrafast laser machining method275
5US20050226287A1Femtosecond laser processing system with process parameters, controls and feedback267
6US5786560A3-dimensional micromachining with femtosecond laser pulses265
7US20060169677A1Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser225
8US6573026B1Femtosecond laser writing of glass, including borosilicate, sulfide, and lead glasses176
9US6720519B2System and method of laser drilling164
10US20150038313A1Method and apparatus for performing laser filamentation within transparent materials159

Citation counts reflect influence within the searched corpus and skew toward older filings; they are not a measure of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Ultrafast and Femtosecond Lasers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for filing strategy

Three patterns in the data matter more to a filing decision than the raw counts alone: the receiving-office split, the citation concentration among a handful of foundational patents, and the plateau in year-over-year filing.

Jurisdiction
456 US filings
vs. 198 China, 181 EPO

Enforcement risk concentrates in the US first

With the US receiving nearly double the filings of any other single office, freedom-to-operate work for a US launch needs the deepest clearance pass, while China and EPO filings still warrant a full check given their combined share.

Receiving office data
Prior art
377 citations
top-cited record

A small set of foundational patents anchors the field

The most-cited records concern high-energy ultrashort pulse generation and burst-mode micromachining, both from the early era of the technology. Their citation weight reflects age and foundational status more than current enforceability — check expiry dates before assuming they block anything.

Citation ranking
Filing pace
75 → 42
peak (2020) to midpoint (2022)

Filing has passed its peak

The decline from a 2020 peak of 75 filings to 42 by 2022 suggests the core claim space around pulse generation and micromachining is substantially occupied. New entrants are more likely to find room in adjacent application branches than in the core source technology.

Filing trend
Co-filing
10 pairs
co-assignee combinations

Collaboration is limited and academic

Only ten co-assignee pairs appear in the dataset, and the strongest links are university-research-centre pairings rather than corporate joint filings, pointing to a field where most patenting still happens inside single organisations.

Co-assignee data
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to ultrafast and femtosecond lasers, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Ultrafast and Femtosecond Lasers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the ultrafast laser claim space

Assignee activity in this corpus is dominated by medical-laser, industrial-laser and university players, several of which show no filings in the most recent year — consistent with the broader plateau in the filing trend rather than any single company's retreat.

Momentum
0 filings
latest year, multiple leaders

Recent-year activity has gone quiet across the board

Several of the most historically active assignees, including medical-laser and industrial-laser specialists, show zero filings in the latest tracked year. Given publication lag, this understates true activity but still points to a slowdown in fresh claims from established players.

Recent-year momentum
Collaboration
9 co-filings
strongest pairs

Academic partnerships drive the densest collaboration

The strongest co-assignee links in the dataset connect a national research centre with two French universities, each pairing appearing nine times — a pattern of sustained academic collaboration rather than one-off joint filings.

Co-assignee pairs
Application mix
595 records
B23K materials processing

Industrial processing rivals source-technology filing

With B23K nearly matching H01S in volume, companies positioned only around laser source physics are filing into a category where materials-processing specialists have comparable claim density — a reason to check micromachining and welding prior art even for source-side inventions.

IPC composition
🔍
Under-claimed branches worth a closer look
Sub-areas where filing density is thin relative to the size of the core clusters
burst-mode pulse shaping for glass formingfemtosecond-guided implant surface texturingadaptive repetition-rate control for semiconductor dicingnonlinear beam-shaping optics for surgical delivery
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Alcon Surgical Laser, Inc.0
Rofin-Sinar Technologies0
Synova SA0
IMRA America, Inc.0
Board of Trustees of Michigan State University0
Panasonic Corporation (Japan)0
Bobst Bielefeld GmbH0
Centre National de la Recherche Scientifique (CNRS)0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Ultrafast and Femtosecond Lasers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Turning this landscape into a filing decision

A citation table and an IPC chart tell you where the crowd has been. Deciding where to file next means testing a specific claim against that crowd before drafting it.

Stress-test a claim against the cited core

Run a candidate claim on pulse control or micromachining against the foundational high-citation records to see how much room actually remains around them.

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Map white space in the adjacent branches

Use the IPC composition to identify which downstream application areas — implants, semiconductor dicing, surgical delivery — are thin relative to the core clusters.

Explore white space in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Ultrafast and Femtosecond Lasers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on ultrafast laser patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Ultrafast and Femtosecond Lasers covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Research Ultrafast and Femtosecond Lasers in depth with Eureka

Go past this page: query the whole ultrafast and femtosecond lasers corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.