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Run your analysis now →Ultrafast and femtosecond laser patents span two distinct engineering problems: generating and controlling pulses of extremely short duration, and applying those pulses to cut, weld, dice or reshape materials with minimal thermal damage. The search corpus captures both sides through the IPC split between H01S (laser sources and stimulated emission) and B23K (welding, soldering and cutting), with G02B and G02F covering the optical control layer in between. Medical and semiconductor applications — A61F, A61B, H01L — appear as smaller but persistent downstream branches.
The 1,215 families in this dataset span filings from 2017 through mid-2026, with the most recent year understated because publication typically lags filing by around 18 months. Reading the trend requires treating the last one to two years as a floor, not a ceiling.
The dataset's filing curve and IPC distribution together describe a field that expanded through the late 2010s, peaked in 2020, and has since settled into a slower filing rhythm concentrated around two core application areas.
Filings rose from 50 in 2017 to a peak of 75 in 2020, then eased back toward the midpoint of 42 in 2022. That pattern is more consistent with a technology whose core claim space has been substantially staked out than with one still in an early land-grab phase.
H01S (607 records) and B23K (595 records) sit almost level, meaning source-side innovation and materials-processing innovation are filed at comparable rates. G02B and G02F, each in the 140-150 range, mark the optical-control layer connecting the two; A61F, H01L, A61B and C03B show the field's reach into implants, semiconductors, surgery and glass forming.
Shares are the percentage of the 1,215 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about ultrafast and femtosecond lasers and every answer comes back with the patent numbers behind it.
Try EurekaA femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.Filed by IMRA America, published 2014-04-03. Its claim scope over integrated feedback-controlled femtosecond processing systems is a recurring reference point for later filers in this space.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US5400350A | Method and apparatus for generating high energy ultrashort pulses | 377 |
| 2 | US6552301B2 | Burst-ultrafast laser machining method | 306 |
| 3 | US20050274702A1 | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser | 275 |
| 4 | US20010009250A1 | Burst-ultrafast laser machining method | 275 |
| 5 | US20050226287A1 | Femtosecond laser processing system with process parameters, controls and feedback | 267 |
| 6 | US5786560A | 3-dimensional micromachining with femtosecond laser pulses | 265 |
| 7 | US20060169677A1 | Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser | 225 |
| 8 | US6573026B1 | Femtosecond laser writing of glass, including borosilicate, sulfide, and lead glasses | 176 |
| 9 | US6720519B2 | System and method of laser drilling | 164 |
| 10 | US20150038313A1 | Method and apparatus for performing laser filamentation within transparent materials | 159 |
Citation counts reflect influence within the searched corpus and skew toward older filings; they are not a measure of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Three patterns in the data matter more to a filing decision than the raw counts alone: the receiving-office split, the citation concentration among a handful of foundational patents, and the plateau in year-over-year filing.
With the US receiving nearly double the filings of any other single office, freedom-to-operate work for a US launch needs the deepest clearance pass, while China and EPO filings still warrant a full check given their combined share.
The most-cited records concern high-energy ultrashort pulse generation and burst-mode micromachining, both from the early era of the technology. Their citation weight reflects age and foundational status more than current enforceability — check expiry dates before assuming they block anything.
The decline from a 2020 peak of 75 filings to 42 by 2022 suggests the core claim space around pulse generation and micromachining is substantially occupied. New entrants are more likely to find room in adjacent application branches than in the core source technology.
Only ten co-assignee pairs appear in the dataset, and the strongest links are university-research-centre pairings rather than corporate joint filings, pointing to a field where most patenting still happens inside single organisations.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to ultrafast and femtosecond lasers, with the prior art for and against each one.
Assignee activity in this corpus is dominated by medical-laser, industrial-laser and university players, several of which show no filings in the most recent year — consistent with the broader plateau in the filing trend rather than any single company's retreat.
Several of the most historically active assignees, including medical-laser and industrial-laser specialists, show zero filings in the latest tracked year. Given publication lag, this understates true activity but still points to a slowdown in fresh claims from established players.
The strongest co-assignee links in the dataset connect a national research centre with two French universities, each pairing appearing nine times — a pattern of sustained academic collaboration rather than one-off joint filings.
With B23K nearly matching H01S in volume, companies positioned only around laser source physics are filing into a category where materials-processing specialists have comparable claim density — a reason to check micromachining and welding prior art even for source-side inventions.
| Assignee | Recent year | YoY |
|---|---|---|
| Alcon Surgical Laser, Inc. | 0 | — |
| Rofin-Sinar Technologies | 0 | — |
| Synova SA | 0 | — |
| IMRA America, Inc. | 0 | — |
| Board of Trustees of Michigan State University | 0 | — |
| Panasonic Corporation (Japan) | 0 | — |
| Bobst Bielefeld GmbH | 0 | — |
| Centre National de la Recherche Scientifique (CNRS) | 0 | — |
A citation table and an IPC chart tell you where the crowd has been. Deciding where to file next means testing a specific claim against that crowd before drafting it.
Run a candidate claim on pulse control or micromachining against the foundational high-citation records to see how much room actually remains around them.
Test a claim in EurekaUse the IPC composition to identify which downstream application areas — implants, semiconductor dicing, surgical delivery — are thin relative to the core clusters.
Explore white space in EurekaThis corpus defines the category by combining laser-type terms — ultrafast, femtosecond and picosecond laser — with technical concepts like pulse duration, chirped pulse amplification, repetition rate, micromachining and nonlinear effects, restricted to IPC classes H01S3 (lasers), B23K26 (laser beam processing) and G02F1 (optical control devices). That combination captures both the pulse-generation side of the technology and its downstream materials-processing and optical-control applications. Patents that mention femtosecond lasers only in passing, without claiming pulse-duration or repetition-rate control, generally fall outside this definition.
Activity concentrates among medical-laser specialists, industrial laser-processing companies, optical component makers and a handful of research universities, with the field showing a long tail of smaller filers behind the most active assignees. Several of the historically most active organisations show no filings in the latest tracked year, which is partly an artefact of publication lag and partly a genuine slowdown after the 2020 filing peak. No single assignee dominates the field outright; ranking by patent family count is the more reliable comparison than raw document counts, since it neutralises continuation filings.
Filings rose from 50 in 2017 to a peak of 75 in 2020, then fell back toward 42 by 2022, a pattern more typical of a field where the core claim space around pulse generation and basic micromachining has already been substantially staked out. High filing density in the early years does not mean the technology stopped improving; it means the most obvious claims were filed first. Note that the most recent one to two years in any trend chart are understated because publication lags filing by roughly 18 months, so the true 2025-2026 filing rate is likely higher than shown.
The United States receives the largest share of filings in this dataset at 456, nearly double China's 198 and the EPO's 181, with WIPO/PCT filings and smaller volumes in Canada and Australia rounding out the picture. A freedom-to-operate search aimed at a US commercial launch should prioritise the US filings first, but the China and EPO volumes are large enough that skipping them would leave real exposure. WIPO/PCT filings are worth checking separately since they can still enter national phase in jurisdictions not otherwise flagged by direct filing counts.
The core pulse-generation and general micromachining claims are densely filed, but downstream application branches — implant surface texturing, semiconductor dicing with adaptive repetition-rate control, and nonlinear beam-shaping for surgical delivery — show thinner filing density relative to the size of the H01S and B23K clusters. That gap suggests more room to claim specific combinations of pulse control and a downstream application than to claim pulse generation on its own. Confirming true white space requires a freedom-to-operate search against the specific claim language, not just an IPC density comparison.
Go past this page: query the whole ultrafast and femtosecond lasers corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.
Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.