Ultrafast Laser Micromachining Patents: Leaders & White Space 2026
Ultrafast Laser Micromachining Patents: Who Holds the Ground, Where It's Open
30.6% of all 1,162 records sit with just five assignees, but the remaining 69.4% spreads across a long tail of single- and few-filing entrants. Filings rose from 43 in 2017 to a peak of 66 in 2019, then declined to 31 by 2024 — a 49% drop across the 2021-2024 window. The 2025 and 2026 counts are still filling in under publication lag and should not be read as a continued decline.
- 1ROFIN SINAR TECH LLC108
- 2IMRA AMERICA INC106
- 3ELECTRO SCI IND INC79
- 4ABBOTT DIABETES CARE INC35
- 5CORNING INC28
See the full ultrafast laser micromachining analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this field
Who are the leading patent holders in ultrafast laser micromachining?
The assignee ranking for this field covers 100 companies counted by patent family, with a single leader holding 108 records — roughly four times the count held by the fifth-ranked assignee at 28. The top five assignees combined hold 356 records, or 30.6% of the 1,162 records in scope, while the top ten hold 479, or 41.2%. That leaves the majority of the field spread across a long tail of smaller and single-filing entrants, so leadership is concentrated but far from a duopoly.
Is patent filing in ultrafast laser micromachining still growing?
No — filings peaked at 66 records in 2019 and had fallen to 31 by 2024, a 49% decline across the 2021-2024 span, which is the most recent period reliable enough to compare. Figures for 2025 and 2026 are still incomplete because patent publication typically lags actual filing by about 18 months, so they should not be read as evidence the decline continues. The honest read is that filing activity cooled meaningfully after 2019, not that the field went quiet in the last two years.
Which technology areas carry the most patent claims in this field?
B23K, the IPC subclass covering welding, soldering and brazing processes, appears in 52.0% of the 1,162 records in scope — by far the largest share of any single class. H01S (lasers and stimulated emission) and H01L (semiconductor devices) follow at 16.7% and 13.3% respectively. Because a single patent record can carry several IPC classes, these percentages add up to more than 100%, so they describe where claim density sits rather than a clean split of the field.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Ultrafast Laser Micromachining covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.