Ultrasonic Additive Manufacturing Electronics Embedding 2026
Ultrasonic Additive Manufacturing: Embedding Electronics in Metal
UAM bonds metal foils layer-by-layer in the solid state, enabling encapsulation of fragile electronics within metal matrices at low thermal budgets. Four assignees account for all 14 directly relevant patents identified in this dataset.
How UAM Solves the Electronics-in-Metal Embedding Challenge
Ultrasonic Additive Manufacturing (UAM) is a hybrid solid-state metal fabrication process that bonds aluminum foils layer-by-layer using ultrasonic energy combined with periodic CNC machining. Pre-machined pockets in individual foil layers are stacked to form enclosure cavities, which are then capped and encapsulated during subsequent bonding passes, a method defined as the ‘form-then-bond’ approach.
The low-temperature solid-state bonding mechanism is what makes UAM uniquely suited to electronics embedding compared to fusion-based metal AM processes such as laser powder bed fusion or directed energy deposition, where thermal budgets would destroy semiconductor components. A 2018 academic paper formalized a statistical deformation model for aluminum foils to predict viable encapsulation geometries.
For fusion-based metal AM processes where UAM is not applicable, Hamilton Sundstrand Corporation introduced a thermal transition zone architecture: an intermediate-melting-point material encases the embedded electronic before the higher-melting-point base material is deposited around it. This creates a thermally graded encapsulation protecting circuitry without requiring a fundamentally different AM process, with active filings across US and EP jurisdictions from 2019 through 2023.
The field also addresses electronics embedding at the housing and packaging levels. Honeywell International builds structural housings layer-by-layer around pre-placed electronics assemblies with hermetic sealing and electrical feedthroughs, while Intel Corporation applies additive manufacturing to deposit conformal EMI shielding layers over semiconductor package surfaces — signaling entry by large electronics manufacturers into this domain.
A Decade of Electronics-Embedding AM Patent Activity
The field shows a clear developmental arc from 2014 foundational filings through a 2018–2021 core technology development phase to maturation signals in 2022–2024, with Hamilton Sundstrand and Honeywell International filing the most concentrated patent clusters.
Patent Filings by Technology Cluster
Thermal transition zone and housing-level sealing approaches each account for four patents, representing the two dominant IP clusters in the dataset.
↗ Click bars to exploreFiling Activity by Period — Electronics-Embedding AM
The 2018–2021 core development window produced the highest concentration of electronics-embedding AM patents, with continued activity through 2024 signaling ongoing commercial refinement.
↗ Click bars to exploreKey Application Domains for Electronics-Embedding Additive Manufacturing
The electronics-embedding AM patent dataset spans four primary application domains: aerospace and defense smart structures, semiconductor packaging, industrial IoT structural electronics, and multi-material polymer AM for consumer and wearable applications.
Aerospace & Defense Smart Structures
Hamilton Sundstrand Corporation (a subsidiary of Raytheon Technologies / Collins Aerospace) explicitly targets prognostic health monitoring and feedback control systems embedded in metal aircraft and propulsion components. The transition zone architecture patents reference the need for rugged, environmentally sealed embedded electronics in metal parts operating in extreme environments, with active US and EP filings from 2019 through 2023. Honeywell International targets sealed electronics housings for avionic and industrial sensor systems using hermetic additive housing builds.
Aerospace / DefenseSemiconductor Packaging & Consumer Electronics
Intel Corporation’s 2022 US active patent covers high-throughput additive manufacturing for depositing EMI shield layers over molded semiconductor package surfaces with complex geometries. A related 2019 WO filing by Braunisch, Henning addresses the same EMI shielding on package approach. This signals that large semiconductor manufacturers are exploring additive AM as a production-viable process for high-volume semiconductor packaging applications.
Semiconductor PackagingIndustrial IoT and Structural Electronics
Academic literature including a 2019 paper on design concepts for integrating electronic components into metal laser-based powder bed fusion parts specifically targets automated sensor integration in industrial metal parts. Survey papers from 2016 and 2017 on links between additive manufacturing and sensor integration position structural electronics — components that are simultaneously load-bearing and functionally sensing — as the long-term destination for embedded electronics AM. UAM is identified as the most technically mature metal route to achieving this goal.
Industrial IoTMulti-Material Polymer AM Embedding
The Board of Regents of the University of Texas System filed a 2016 US patent covering metal objects spanning internal cavities in structures fabricated by additive manufacturing, establishing the concept of embedding secondary objects within AM structures during the polymer and multi-material build process. A 2021 US continuation filing extended this IP. This approach is relevant to consumer products, robotics, and wearable electronics applications where metal-in-polymer embedding is required.
Multi-Material AMKey Patent Assignees in Electronics-Embedding Additive Manufacturing
The electronics-embedding AM patent landscape is highly concentrated: four assignees account for all 14 directly relevant patents in this dataset, with Hamilton Sundstrand Corporation and Honeywell International holding the two largest clusters in US and EP jurisdictions.
Top Assignees by Patent Count — Electronics-Embedding AM Dataset
↗ Click bars to exploreHamilton Sundstrand Corporation
Hamilton Sundstrand holds 4 patents in this dataset across US and EP jurisdictions, filing from 2019 through 2023, all covering embedded electronics in metal additive manufacturing builds enabled by low-melting temperature transition zone using material gradients. The IP family includes a 2019 US filing, a 2019 EP filing, two 2021 US active patents, and a 2023 US active continuation — indicating active prosecution and commercial development intent. All filings in this dataset are listed as active status.
United States / EuropeHoneywell International Inc.
Honeywell International holds 4 patents in this dataset covering embedding electronics in housing using additive manufacturing, filed across US and EP jurisdictions from February 2021 through 2024. The portfolio includes a 2021 US active patent, a 2021 EP active patent, a 2023 EP filing, and a 2024 US active patent that adds detail around electrical connector sealing architectures for fielded deployment. All four filings are listed as active status in this dataset.
United States / EuropeLatest Signals: Where Electronics-Embedding AM Is Heading
The most recent filings in this dataset (2022–2024) point toward three converging directions: continued refinement of thermal transition zone architectures for production deployment, fully sealed electronics housing qualification, and additive EMI shielding entry by semiconductor manufacturers.
Transition Zone IP Family Actively Extended Through 2023
Hamilton Sundstrand’s 2023 US continuation filing on embedded electronics in metal AM builds enabled by low-melting temperature transition zone using material gradients signals that this IP family is being actively extended, likely to cover broader material gradient combinations and process parameters. The presence of active filings from 2019 through 2023 in a single IP family indicates this approach is progressing toward production deployment. New entrants in aerospace applications face freedom-to-operate risk across both US and EP jurisdictions.
Honeywell’s 2024 Patent Adds Electrical Connector Sealing Detail
Honeywell’s 2024 US active patent — the most recently published patent in this dataset — adds specific detail around electrical connector sealing architectures for embedded electronics housings built by additive manufacturing. This refinement from initial housing-embedding conception toward system-level integration and sealing qualification suggests Honeywell is approaching fielded deployment readiness. The focus on connectors bridging embedded and external electronics represents a key system integration milestone.
Hamilton Sundstrand Transition Zone vs. Honeywell Housing Embedding: Approach Comparison
Click any row to explore further.
| Dimension | Hamilton Sundstrand — Transition Zone | Honeywell International — Housing Embedding |
|---|---|---|
| Core Mechanism | Low-melting-point transition material encases embedded electronics before higher-melting base metal AM deposition | Structural housing built layer-by-layer by AM around pre-placed electronics assemblies with hermetic sealing |
| AM Process Type | Fusion-based metal AM (directed energy deposition, laser powder bed fusion compatible) | Additive manufacturing used to form the housing/enclosure structure itself |
| Thermal Protection Method | Material gradient: intermediate-melting-point layer acts as thermal buffer around electronics | Pre-placement of electronics before housing walls are built; housing seals environment post-placement |
| Electrical Connectivity | Not explicitly specified as a primary focus in this IP family | Connectors bridge embedded electronics to external system electronics via sealed feedthroughs |
| Patent Filings in Dataset | 4 active filings: US (2019), EP (2019), US (2021 ×2), US (2023) | 4 active filings: US (2021), EP (2021), EP (2023), US (2024) |
| Primary Application Target | Aerospace and defense metal components with prognostic health monitoring and feedback control electronics | Avionic and industrial sensor system housings requiring environmental isolation and hermetic sealing |
| Most Recent Filing | 2023 US continuation — likely expanding material gradient combinations and process parameters | 2024 US active patent — adds electrical connector sealing architecture detail for fielded deployment |
Frequently Asked Questions: UAM Electronics Embedding Patents
The form-then-bond approach, defined in a 2018 academic paper, involves creating pre-machined pockets in individual aluminum foil layers before ultrasonically welding them layer-by-layer in the solid state. These stacked pockets form enclosure cavities that accommodate fragile electronic components, which are then capped and encapsulated during subsequent bonding passes. A statistical model of foil deformation is used to predict viable encapsulation geometries.
UAM bonds metal foils at ambient-to-low temperatures via high-frequency vibration, avoiding the thermal damage that destroys semiconductor components in fusion-based AM processes such as laser powder bed fusion or directed energy deposition. The low-temperature solid-state bonding mechanism is identified in the literature as what makes UAM uniquely suited to electronics embedding within metal matrices.
Hamilton Sundstrand Corporation’s transition zone architecture involves encasing an embedded electronic in an intermediate-melting-point material before the higher-melting-point base material is deposited around it during fusion-based metal AM. This creates a thermally graded encapsulation that protects circuitry without requiring a fundamentally different AM process. The company holds at least four active filings across US and EP jurisdictions from 2019 through 2023.
Honeywell’s approach builds the structural housing itself layer-by-layer using additive manufacturing around pre-placed electronics assemblies, rather than embedding electronics within the bulk metal matrix of a structural part. Electrical feedthroughs connect the sealed interior to external system electronics. Honeywell’s 2024 US patent adds specific detail around electrical connector sealing architectures for fielded deployment.
Within the 14 directly relevant patents identified in this dataset, Hamilton Sundstrand Corporation and Honeywell International Inc. each hold 4 patents, making them the two largest assignees. Nano-Dimension Technologies, Intel Corporation (including a related WO filing by Braunisch, Henning), and the Board of Regents of the University of Texas System each account for 2 patents in the dataset.
The absence of issued UAM-specific patents in this dataset suggests that core UAM electronics-embedding IP may reside in filings not captured in this search, or that the academic community has led this specific sub-field. The dataset identifies this as a potential white space for IP development by process equipment developers such as Fabrisonic, the primary UAM equipment company, or defense primes.
Data and insights on this page are based on a limited patent and literature dataset and are for reference only. Figures may not represent the complete technology landscape.