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Run your analysis now →Filing growth compares 2021 (19 records) with 2024 (9) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 282 records in scope (CR5), not by the ranked leaders only.
This review scopes 282 published records matching transducer array and piezoelectric element terminology cross-referenced against design parameters — element pitch, kerf spacing, acoustic matching layers, backing material, element crosstalk and bandwidth — filed between 2015 and mid-2026. The dataset spans intravascular, external-probe and industrial ultrasound applications, so the same design language (matching layers, kerf geometry) shows up across medical diagnostic, therapeutic and non-medical acoustic uses.
Filing activity is concentrated among a small number of large medical device manufacturers, with a long tail of single- or few-filing entrants covering narrower mechanical and materials variants. Receiving-office data shows the United States as the dominant filing venue, followed by Europe and the PCT route, which points to a global-but-US-anchored prosecution strategy among the leading players.
Pick a task. Every answer cites the patents behind it.
Two views of the same 282-record dataset: how filing volume has moved year over year, and how records distribute across IPC subclasses.
Volume rose to a peak of 19 records in 2021, then declined to 9 by 2024 — a 53% drop over three years. Records for 2025 and 2026 are still partial because publication typically lags filing by around 18 months, so the most recent bars will fill in as later-filed applications publish.
A61B (diagnosis and surgery) covers 78.0% of the 282 records and B06B (mechanical vibration generation) covers 37.9%, confirming the medical-imaging core of this design space. Because records can carry multiple IPC codes, these shares sum to well over 100% of the record total — they are not mutually exclusive buckets.
Shares are the percentage of the 282 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about ultrasound transducer array design and every answer comes back with the patent numbers behind it.
Try EurekaAn ultrasound transducer array is formed by stacking an acoustic lens on a laminated body of a transducer section including transducers and first acoustic matching layers, and a second acoustic matching layer. Arrangement of the laminated body is such that a groove width of a groove portion of the transducer section is equal to or greater than a groove width of a groove portion of the second acoustic matching layer.The claim ties groove geometry between the transducer section and the second matching layer, which narrows the specific stack configurations available to a designer without infringing.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US7846101B2 | High resolution intravascular ultrasound transducer assembly having a flexible substrate | 488 |
| 2 | US5744898A | Ultrasound transducer array with transmitter/receiver integrated circuitry | 425 |
| 3 | US7226417B1 | High resolution intravascular ultrasound transducer assembly having a flexible substrate | 273 |
| 4 | US20040030268A1 | Controlled high efficiency lesion formation using high intensity ultrasound | 238 |
| 5 | US5857974A | High resolution intravascular ultrasound transducer assembly having a flexible substrate | 231 |
| 6 | US7736317B2 | Method and apparatus for delivering therapy in and association with an intravascular ultrasound device | 211 |
| 7 | US6457365B1 | Method and apparatus for ultrasonic imaging | 203 |
| 8 | US5671746A | Elevation steerable ultrasound transducer array | 188 |
| 9 | US6049958A | High resolution intravascular ultrasound transducer assembly having a flexible substrate and method for manuf… | 167 |
| 10 | US6780157B2 | Method and apparatus for ultrasonic imaging | 139 |
Citation counts reward older filings simply because they have had more time to accumulate citations within this corpus — read them as a signal of influence on subsequent design work, not as a measure of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
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Browse MCP servers →Three patterns worth acting on before drafting new claims or scoping freedom-to-operate in this space.
The leading assignee alone accounts for 45 of the 282 records in scope, and the top five combined hold 131 (46.5%). Beyond tenth place (8 records), filing thins into single- and double-digit contributors, which usually means narrow, defensible niches rather than open ground.
Volume peaked at 19 records in 2021 and dropped to 9 by 2024. Several of the most active historical filers show zero activity in the latest year, which is consistent with either a maturing core design or a pause ahead of a new filing cycle; the partial 2025-2026 data cannot yet distinguish between the two.
A61B and B06B dominate at 78.0% and 37.9% of records respectively, but H10N and H01L — the classes most relevant to piezoelectric materials and semiconductor integration — sit at 10.3% and 6.7%. That gap is where array fabrication and materials innovation get comparatively less claim coverage than system-level imaging design.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to ultrasound transducer array design, with the prior art for and against each one.
A small set of medical imaging manufacturers account for most volume; the remaining ranked assignees hold single-digit record counts each, typically tied to specific probe geometries or materials.
The leading assignee's 45 records is roughly three times the fifth-place count of 15, indicating a sustained, multi-year filing programme rather than a single burst of activity.
Fifth place sits at 15 records and tenth place at 8, together with the leader making up 64.2% of all 282 records. Below tenth, the ranking spreads across many single- and low-digit filers.
Multiple assignees that built substantial portfolios earlier in the window show no recorded filings in the latest year, including one large filer at -100% year-on-year. This is consistent with the broader post-2021 filing decline rather than any single company exiting the field.
| Assignee | Recent year | YoY |
|---|---|---|
| Fujifilm Corporation | 1 | — |
| Koninklijke Philips N.V. | 0 | -100% |
| Seno Medical Instruments Inc. | 0 | — |
| ENDOSONICS CORP | 0 | — |
| General Electric Company | 0 | — |
| Fujifilm SonoSite Inc. | 0 | — |
| Philips Image Guided Therapy Corp. | 0 | — |
| Siemens Medical Solutions USA Inc. | 0 | -100% |
The dataset points to a mature core design with thinner coverage in materials and fabrication-level claims.
Given the citation weight on intravascular transducer assemblies with flexible substrates, any new matching-layer or groove-geometry design should be checked against the most-cited records before drafting.
Explore in EurekaH10N and H01L coverage sits well below the A61B and B06B core, suggesting piezoelectric composite and semiconductor-integration claims face less prior art density.
Explore in EurekaBecause 2025-2026 records are still incomplete due to publication lag, re-run this trend in a future update to see whether the post-2021 decline continues or reverses.
Explore in EurekaWithin this 282-record dataset, one assignee leads with 45 records, well ahead of the fifth-ranked assignee at 15. The top five assignees together account for 131 records, or 46.5% of all records in scope. Beyond the tenth-ranked assignee (8 records), the field spreads into a long tail of companies with only a handful of filings each, typically tied to specific probe or materials niches.
Filing peaked at 19 records in 2021 and had fallen to 9 by 2024, a 53% decline over that three-year span. However, publication typically lags filing by around 18 months, so the 2025 and 2026 figures in any dataset are necessarily incomplete and should not yet be read as confirming a continued decline. A clearer read on the current trend will only be possible once those years finish publishing.
The A61B subclass (diagnosis and surgery) covers 78.0% of the 282 records, and B06B (mechanical vibration generation) covers 37.9%, reflecting the medical-imaging core of this field. Because a single record can carry multiple IPC codes, these percentages overlap and sum to more than 100%. Adjacent classes tied to materials and solid-state integration, such as H10N and H01L, sit far lower at 10.3% and 6.7% respectively, indicating comparatively less claim density there.
The clearest under-claimed areas relative to the imaging core are piezoelectric composite fabrication, backing material damping profiles, element crosstalk suppression geometry and kerf-fill acoustic isolation — branches that sit in the thinner H10N and H01L classes rather than the dominant A61B and B06B classes. This does not mean these branches are unclaimed, only that filing density is lower there than in core imaging-system claims. Any new filing in these areas should still run a targeted prior-art search rather than assume open ground.
US20170172543A1, assigned to Olympus and filed in 2017, claims an ultrasound transducer array built by stacking an acoustic lens on a laminated body containing a transducer section with first acoustic matching layers, plus a second acoustic matching layer, where the groove width of the transducer section's groove portion is equal to or greater than that of the second matching layer's groove portion. That specific groove-width relationship between the two layers is the operative constraint. A design that inverts that relationship, or removes one of the matching layers entirely, would sit outside this specific claim, though it should still be checked against the wider matching-layer prior art in this dataset.
Go past this page: query the whole ultrasound transducer array design corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.