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UV-C LED Efficiency Patents: Leaders, Trends & White Space 2026

UV-C LED Efficiency Patents: Leaders, Trends & White Space 2026
https://www.patsnap.com/resources/blog/rd-blog/uv-c-led-efficiency-enhancement-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Lighting & LED
UV-C LED efficiency enhancement patents: who holds the light-extraction claims
  • Filing already peaked. 2020 recorded 18 filings against 87 total families, and the count has since drifted back down rather than climbed.
  • China dominates the filing venue. 48 of the tracked records were filed in China, more than the EPO, US, PCT, Taiwan and Germany combined.
  • A tight cluster of co-filers controls the densest claim space. Three assignee pairs each share 29-31 co-filed records, concentrating the most defensible ground in a handful of related entities.
Get a prior-art report on your approach
87
Published Records
-14%
3-Yr Growth (lag-adjusted)
CN
Leading Jurisdiction
46
Active Filers Ranked
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the patent record shows about UV-C LED efficiency work

UV-C LED efficiency patents cluster tightly around light extraction, external quantum efficiency and droop mitigation — the three levers that determine whether a deep-UV chip is commercially usable rather than a lab curiosity. The dataset of 87 families spans 2015 through the current filing year, with almost all activity sitting inside a single IPC subclass, H01L, and the semiconductor-device claims built on top of it.

Filing rose steadily to a peak in 2020, then flattened and declined toward the midpoint year and beyond. That pattern reads less as an exhausted field and more as a technology that consolidated around a known set of structures — reflecting photonic-crystal layers, p-AlGaN thickness control, vertical chip architectures — after an initial wave of foundational filing.

Filing activity by year, 2017-2026
  1. 1ULVAC INC32
  2. 2TOKYO OHKA KOGYO CO LTD31
  3. 3RIKEN CO LTD29
  4. 4MARUBUN29
  5. 5TOSHIBA MASCH CO LTD21
  6. 6SHIBAURA MASCH CO LTD11
  7. 7DAI NIPPON PRINTING CO LTD8
  8. 8SUZHOU UVCANTEK CO LTD8
  9. 9NIPPON TUNGSTEN CORP6
  10. 10JIANGXI ZHAO CHI SEMICON CO LTD5
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on UV-C LED Efficiency Enhancement covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The data

Filing trend and technology composition

Two views of the same 87-family dataset: how filing activity has moved year over year, and which IPC subclasses the claims actually sit in.

A filing peak already behind us

Filings ran 3 in 2017, climbed to a peak of 18 in 2020, then eased to 6 at the 2022 midpoint. Because publication lags filing by roughly 18 months, the final year or two will always look thinner than it eventually turns out to be — but the shape from peak to midpoint is a real decline, not a data artefact.

A filing peak already behind us0510152032017201820191820202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Concentrated almost entirely in one subclass

All 87 records sit in H01L (semiconductor devices), with smaller overlaps into B82Y nanotechnology applications and H10D general semiconductor devices (7 records each), and single-digit spillover into coating/deposition (C23C) and crystal growth (C30B). That concentration means the claim space is not spread thin across adjacent fields — it is stacked in one place.

Concentrated almost entirely in one subclassH01L · Semiconductor devices87100.0%B82Y · Nanotechnology applications78.0%H10D · Semiconductor devices (general)78.0%C23C · Coating & surface deposition11.1%C30B · Crystal growth11.1%

Shares are the percentage of the 87 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on UV-C LED Efficiency Enhancement covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on UV-C LED Efficiency Enhancement with Eureka

This page is one run against one query. Ask Eureka your own question about uv-c led efficiency enhancement and every answer comes back with the patent numbers behind it.

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Key patents

The most-cited records in this dataset

Representative filing
US20180198026A12018-07-12

US20180198026A1 — Deep ultraviolet LED and method for manufacturing the same

MARUBUN CORPORATION

The light extraction efficiency of a deep ultraviolet LED is increased. The deep ultraviolet LED has a design wavelength λ, and includes, sequentially arranged from a side opposite to a substrate, a reflecting electrode layer, a metal layer, a p-GaN contact layer, a p-AlGaN layer that is transparent to light with the wavelength λ, one of a multi-quantum barrier layer or an electron blocking layer, a barrier layer, and a quantum well layer. A thickness of the p-AlGaN layer is less than or equal to 100 nm. A reflecting photonic crystal periodic structure having a plurality of voids is provided in a region in a thickness direction including at least an interface between the p-GaN contact layer.Filed by Marubun Corporation, published 2018-07-12.

US20180198026A1 — patent drawing 1US20180198026A1 — patent drawing 2
View full filing
Highest-citation UV-C LED efficiency patents
#Publication no.Patent titleCitations
1CN111599906A一种垂直结构深紫外LED芯片的制造方法16
2EP2942818A1Deep ultraviolet LED and method for manufacturing same15
3US20160133785A1Deep ultraviolet LED and method for manufacturing the same15
4CN111739989AAlGaN基深紫外LED外延片及制备方法13
5CN110808320A深紫外LED结构及其制作方法10
6CN107863428A一种纳米级图形化衬底及其制作方法10
7WO2017168811A1Deep ultraviolet LED and production method therefor10
8US20240304757A1Vertical structure deep ultraviolet light emitting diode, manufacturing method thereof and epitaxial structure8
9US9929317B2Deep ultraviolet LED and method for manufacturing the same8
10CN110265516A一种深紫外LED芯片及其制备方法7

Citation counts inside a searched corpus favour older filings that have had more time to accumulate references — read them as a signal of influence on later filers, not as a ranking of current commercial relevance.

Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on UV-C LED Efficiency Enhancement covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-outs from the trend, venue and citation data that matter more than the raw counts on their own.

Filing momentum
18 → 6
peak year 2020 vs. 2022 midpoint

The wave has already crested

Filing built steadily to 2020 and has since fallen back toward roughly a third of peak volume by the midpoint year. That is consistent with a field that solved its first-generation structural problems and is now iterating rather than staking new foundational ground.

Recency caveat applies: publication lag understates the last one to two years.
Filing geography
48 of 87
records filed in China

China is the primary filing venue, by a wide margin

Chinese filings outnumber the EPO, US, PCT, Taiwan and Germany combined, which shifts both the freedom-to-operate analysis and the likely first-examiner jurisdiction for anyone entering this space now.

EPO (17) and US (13) are the next largest venues.
Citation concentration
16 citations
top-cited record, CN111599906A

The most-cited work is a vertical-chip fabrication method

The five most-cited records split between vertical-structure fabrication methods and epitaxial/AlGaN-based structural claims, with citation counts in the 10-16 range — a tight cluster rather than one outlier dominating the field.

Older records accumulate citations by default; treat this as influence, not current relevance.
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to uv-c led efficiency enhancement, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on UV-C LED Efficiency Enhancement covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the ground, and where it is still open

Co-filing patterns point to a small number of tightly linked assignees controlling the densest claim space, with a long tail of single-filing entrants around them.

Core co-filing cluster
29-31 shared records
top three co-assignee pairs

A small cluster files together repeatedly

The strongest co-assignee pairs in the dataset share between 29 and 31 records each, and the same handful of organisations recur across all three top pairs — a signature of a tightly coordinated equipment-and-materials filing strategy rather than independent competitors.

10 co-assignee pairs exist in total across the dataset.
Recent momentum
0 in latest year
across every tracked top assignee

No assignee is currently accelerating

Every one of the leading assignees shows zero filings in the most recent tracked year. Given the 18-month publication lag this likely understates true activity, but it also means no single player is visibly pulling ahead right now.

Read alongside the overall post-2020 filing decline.
Geographic spread
6 receiving offices
China, EPO, US, WIPO, Taiwan, Germany

Filing strategy is regionally concentrated, not global

Two-thirds of records route through China alone, with Europe and the US as secondary venues and only a handful of PCT, Taiwan and Germany filings. A new entrant's freedom-to-operate work should weight Chinese prior art heavily before anywhere else.

Taiwan and Germany each carry only single-digit record counts.
🔍
Under-claimed sub-areas worth a closer look
Branches adjacent to the core light-extraction and droop-mitigation claims that carry comparatively thin filing density in this dataset.
Photonic-crystal void geometry optimisationp-AlGaN thickness/transparency tuning below 100nmReflecting electrode-metal interface engineeringAlGaN epitaxial defect-density reductionNon-vertical chip light-extraction architectures
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
ULVAC, Inc.0
Tokyo Ohka Kogyo Co., Ltd.0
RIKEN Corporation0
Marubun Corporation0
Toshiba Machine Co., Ltd.0
Suzhou UVeek Technology Co., Ltd.0
RIKEN (National Research and Development Agency)0
Dai Nippon Printing Co., Ltd.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on UV-C LED Efficiency Enhancement covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this analysis

The trend and assignee data point to specific next steps depending on whether you are filing, licensing or scouting for acquisition targets.

Check freedom-to-operate against the China filing cluster

With 48 of 87 records filed in China and a tightly linked co-assignee cluster controlling the densest claims, any new structural or epitaxial approach needs a China-weighted prior-art search before proceeding.

Run a freedom-to-operate search

Probe the under-claimed branches before the next filing wave

Photonic-crystal geometry variants and sub-100nm p-AlGaN tuning show thinner claim density than the core vertical-chip fabrication methods — a narrower but more available filing target.

Explore white space in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on UV-C LED Efficiency Enhancement covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about UV-C LED efficiency patents

Answers are grounded in the same dataset. Derived from a Patsnap search on UV-C LED Efficiency Enhancement covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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