The dataset ranks 100 assignees by record count, and the leader holds 404 of the 2,517 records in scope, well ahead of fifth place at 119. The top 5 combined account for 43.5% of all records, and the top 10 reach 64.1%, so while the field has a clear leading tier, more than a third of filings sit outside even the top 10. This is a concentrated field, not a single-company monopoly.

Filing peaked at 54 records in 2017 and has trended downward since; the documented 2021-to-2024 window shows a -41% move, from 27 down to 16 records. Figures for 2025 and later are understated because patent publication typically lags filing by around 18 months, so the most recent years should not yet be read as confirmation of continued decline. The multi-year direction through 2024, however, is a real slowdown from the 2017 peak.

Almost all records (91.7%) carry an H01H switches-and-relays classification, which is the core mechanism claim. Beneath that, contact-material chemistry is the busiest secondary area, with 14.5% of records touching C22C alloy claims and 7.9% touching B22F powder-metallurgy claims — both tied to contact wear, current-chopping behaviour and dielectric performance. Protective circuitry (H02H), insulation (H01B) and measurement (G01R) each account for under 5% of records.