Wafer Level Chip Scale Packaging Patents: Leaders & Trends 2026
Wafer Level Chip Scale Packaging Patents: Who Leads and Where Filings Are Heading
46.5% concentration. The five most active filers account for 2,017 of the 4,342 records in scope — a field with a clear head but still open beyond it. Filings ran from 349 in 2017 to a peak of 411 in 2018, then eased to 286 by 2021 and 249 by 2024 — a 13% decline over that three-year window. 2025 and 2026 figures are still incomplete because of publication lag and should not be read as a drop-off.
- 1TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD20.2%
- 2SAMSUNG ELECTRONICS CO LTD12.0%
- 3STATS CHIPPAC LTD6.8%
- 4QUALCOMM INC3.8%
- 5INTEL CORP3.7%
See the full wafer level chip scale packaging analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about wafer level chip scale packaging patents
Who holds the most patents in wafer level chip scale packaging?
One company leads the ranked field with 876 records, well ahead of the fifth-ranked filer at 159 and the tenth-ranked filer at 106. The top five filers combined account for 46.5% of the 4,342 records in scope, and the top ten reach 61.9%. That leaves a substantial tail of smaller filers, so leadership at the top does not mean the whole field is closed off.
Is patent filing in wafer level chip scale packaging still growing?
Filing peaked in 2018 at 411 records and has since eased, moving from 286 in 2021 to 249 in 2024, a 13% decline over that span. That is the most reliable read available because 2024 is the last year publication counts can be treated as complete; 2025 and 2026 figures are still filling in due to the typical 18-month lag between filing and publication, so they should not be read as evidence of a steeper drop.
What technology areas dominate WLCSP patent claims?
H01L, the general semiconductor devices class, appears in 90.4% of the 4,342 records in scope, and H10W appears in 55.4%, indicating that redistribution-layer and interconnect claims are now filed as a substantial sub-track rather than an afterthought. Smaller but still notable shares sit in H05K (printed circuits, 4.9%), H10D (3.5%), H01Q (antennas, 2.4%), H10N (2.4%) and B81B (MEMS, 2.0%). Because a single record can carry several IPC classes, these percentages sum to more than 100% and are each measured against the same 4,342-record base.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Wafer Level Chip Scale Packaging covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.