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Wafer Level Optics & Molded Lens Patents: Top Companies 2026

Wafer Level Optics & Molded Lens Patents: Top Companies 2026
https://www.patsnap.com/resources/blog/rd-blog/wafer-level-optics-and-molded-lenses-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Camera Lens Modules
Wafer Level Optics and Molded Lens Patents: Who Holds the Ground
  • Concentration is moderate, not extreme. the five most active filers hold 32.2% of all 936 records in scope, and the top ten hold 45.1% — meaningful share, but well short of lockout.
  • Filing accelerated into 2024. activity rose from 33 records in 2021 to 60 in 2024, an 82% increase over that three-year span, before the 2025-2026 count understates true filing due to publication lag.
  • Optical elements dominate the claim map. G02B covers 53.4% of the 936 records, more than double the next-largest class, with plastics-shaping classes B29D and B29C each near 18%.
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936
Published Records
32%
Top-5 Share of All Records
+82%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (33 records) with 2024 (60) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 936 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

Wafer level optics and molded lens patents cover the manufacturing side of miniature optics: replicating lens arrays across a wafer, controlling replication accuracy and surface form error, managing mold lifetime in glass and plastic molding, and holding stacking alignment tight enough for multi-element camera modules. The search scope pulls 936 published records from 2015 through the 2026 cut-off, spanning both the optical design side and the process side of the same problem: getting a lens shape to repeat, cheaply, at wafer or panel scale.

The dataset sits at the intersection of optics and materials processing, which shows up directly in the IPC mix: over half the records touch optical elements and systems, while plastics-shaping and glass-shaping classes each account for close to a fifth. That split matters for freedom-to-operate work, because a single molded-lens claim can be blocked from either the optics side or the process side.

Filing activity and technology composition, 2015-2026
  1. 1APPLE INC101
  2. 2MITSUBISHI GAS CHEM CO INC59
  3. 3MGC FILSHEET CO LTD58
  4. 4CORNING INC49
  5. 5CANON KK34
  6. 6AZUMO INC30
  7. 7OPTICS TECHNOLOGY INC29
  8. 8FLEX LIGHTING II22
  9. 93M INNOVATIVE PROPERTIES CO21
  10. 10SEAGATE TECH LLC19
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Wafer Level Optics and Molded Lenses covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The data

Filing trend and technology composition

Two views of the same 936-record corpus: activity by year, and the IPC subclasses those records fall into. Because a record can carry more than one classification, the technology shares add up to more than 100%.

Filing trend, 2017-2026

Filings climbed from 36 in 2017 to a peak of 60 in 2024, including the +82% run between 2021 and 2024. The 2025 and 2026 figures are not a decline — publication lags filing by roughly 18 months, so the most recent two years are still filling in.

Filing trend, 2017-2026015304560362017201820192020202120222023602024202502026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass distribution

G02B (optical elements and systems) touches 53.4% of the 936 records, making it the dominant class by a wide margin. B29D and B29C, the plastics-shaping classes, each sit near 18%, and C03B/C03C glass classes each cover roughly 8-9%, marking the split between optical-design claims and process claims.

IPC subclass distributionG02B · Optical elements & systems50053.4%B29D · Specific plastic articles17118.3%B29C · Shaping of plastics16717.8%C03B · Glass manufacture & shaping869.2%G02C · Spectacles & lenses849.0%C03C · Glass & enamel compositions707.5%F21V · Lighting device components555.9%G06F · Electric digital data processi…555.9%Other79284.6%

Shares are the percentage of the 936 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Wafer Level Optics and Molded Lenses covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key patents

Representative filing and citation record

Representative record
US20210072533A12021-03-11

Head-mounted display (HMD) with spatially-varying retarder optics

VALVE CORPORATION

A head-mounted display, or other near-to-eye display, incorporates optics that include a spatially-varying retarder (SVR). The SVR may be manufactured with a correction factor applied thereto in order to compensate for one or more manufacturing errors that are exhibited in a molded lens and/or a polarizing beam splitter included in the optics of the system.Filed by Valve Corporation, published 2021-03-11 as US20210072533A1.

US20210072533A1 — patent drawing 1US20210072533A1 — patent drawing 2
View full record
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US20220066456A1Obstacle recognition method for autonomous robots761
2US20110227487A1Light emitting display with light mixing within a film435
3US20110255303A1Illumination device comprising a film-based lightguide384
4US7991257B1Method of manufacturing an optical composite354
5US20110273906A1Front illumination device comprising a film-based lightguide324
6US20130155723A1Replaceable lightguide film display301
7US20220026920A1Light weight and real time slam for robots266
8US20200134773A1Machine vision systems, illumination sources for use in machine vision systems, and components for use in the…249
9US20020087047A1Miniature endoscope system243
10US20110277361A1Sign comprising a film-based lightguide233

Citation counts favour older records simply because they have had more time to be cited; treat this table as a map of influential prior art, not of current commercial importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Wafer Level Optics and Molded Lenses covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers say

Three read-throughs from the concentration, growth and classification figures above.

Concentration
32.2%
top 5 share of 936 records

Share is real but not a lockout

The five most active filers combine for 32.2% of all 936 records in scope, and the top ten reach 45.1%. That leaves more than half the corpus held outside the ranked leaders — enough room for a well-drafted claim to clear, provided it avoids the dense zones described below.

Based on the full 100-company assignee ranking.
Momentum
+82%
filings, 2021 to 2024

Growth is recent, not historical

Filing volume rose from 33 records in 2021 to 60 in 2024, an 82% increase over three years and the field's peak year so far. Momentum figures for individual leaders in 2025-2026 read as flat or negative, but that reflects publication lag rather than a real slowdown.

2024 is the most recent year treated as complete.
Classification
53.4%
of records touch G02B

Optics claims outnumber process claims

G02B, covering optical elements and systems, appears in 53.4% of the 936 records — more than double B29D or B29C, the plastics-shaping classes each near 18%. A filer working purely on molding process improvements is operating in a smaller, less crowded slice of the same field.

Classes overlap; shares sum to more than 100% of records.
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Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to wafer level optics and molded lenses, with the prior art for and against each one.

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Co-filing pairs
AssigneeCo-assigneeShared families
Mitsubishi Gas Chemical Company, Inc.MGC Filsheet Co., Ltd.58
Heraeus Quarzglas GmbH & Co. KGShin-Etsu Quartz Products Co., Ltd.18
Mitsubishi Gas Chemical Company, Inc.WINTEC INC17
MGC Filsheet Co., Ltd.WINTEC INC17
Flex Lighting II, LLCNICHOL ANTHONY J6
Flex Lighting II, LLCCOLEMAN ZANE6
Azumo Inc.SMETANA DAVID A2
Corning IncorporatedWELLER MARK OWEN1

Ten co-assignee pairs appear in the data, with the strongest pairing linking a materials supplier and its optical-sheet affiliate — a pattern consistent with joint development between a resin or glass producer and a components maker rather than arm's-length licensing.

Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Wafer Level Optics and Molded Lenses covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the gaps sit

The ranked leaders span optics majors, materials suppliers and a long tail of single- or few-filing entrants. Recent-year momentum for several named leaders reads as flat, which is consistent with publication lag rather than retreat from the field.

Leader
101 records
leading assignee

A single filer well ahead of the field

The top-ranked assignee holds 101 records, well clear of fifth place at 34 and tenth place at 19 — a steep drop-off after the leader that flattens quickly into a long tail.

Counted in patent families across the full ranking.
Mid-field
34 → 19
records, 5th to 10th place

A crowded but not dominant mid-tier

Between fifth and tenth place, record counts fall from 34 to 19, indicating a mid-tier of active filers rather than a second dominant player. This is the group most likely to be actively defending or extending claims year over year.

From the 100-company assignee ranking.
Co-filing
58 records
strongest co-assignee pair

Materials suppliers pair with component makers

The strongest co-assignee pairing in the data links a resin/materials supplier with its film or sheet-focused affiliate at 58 shared records, pointing to integrated supply-chain filing rather than independent competition on that particular claim set.

Ten co-assignee pairs identified in total.
🔍
Under-claimed sub-areas worth checking
Zones where the classification mix suggests lighter claim density relative to the core optics classes.
Mold lifetime monitoring for glass moldingBirefringence control in stacked wafer lensesCost-per-lens process economicsStacking alignment tolerance for multi-element modulesSurface form error correction in replication tooling
Rank all filers by momentum →
Recent-year filing momentum
AssigneeRecent yearYoY
Apple Inc.0-100%
Mitsubishi Gas Chemical Company, Inc.0
MGC Filsheet Co., Ltd.0
Corning Incorporated0
Canon Inc.0-100%
Flex Lighting II, LLC0
3M Innovative Properties Company0-100%
Seagate Technology LLC0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Wafer Level Optics and Molded Lenses covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this

The figures above describe where claims already sit. The next steps are about testing a specific filing or design against that map.

Check a draft claim against the crowded classes

If a new claim touches G02B alongside B29C or B29D, it is entering the two most heavily claimed zones in this corpus at once — worth a closer prior-art pass before filing.

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Track the mid-tier filers, not just the leader

The fifth-to-tenth place filers are closer in volume to each other than to the leader, and are the group most likely to be actively prosecuting new applications right now.

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Revisit white space once 2025-2026 fills in

Because publication lags filing by about 18 months, the under-claimed branches identified here should be re-checked once the most recent two years of filings finish publishing.

Explore the full dataset in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Wafer Level Optics and Molded Lenses covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions

Answers are grounded in the same dataset. Derived from a Patsnap search on Wafer Level Optics and Molded Lenses covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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