WLP Photosensitive Dielectrics Patents: Top Companies & Trends 2026
- 48.8% of all 2,922 records sit with just five assignees, leaving a long tail of single- and low-volume filers behind them.
- Filing held steady into 2024, up 8% from 2021 to 2024, even as the field's early leaders show sharp year-on-year pullbacks.
- H01L dominates at 72.4% of records, but photolithography-specific claims under G03F sit at just 12.4%, a narrower and more contestable band.
Filing growth compares 2021 (279 records) with 2024 (300) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 2,922 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
Wafer level packaging depends on photosensitive dielectric materials — chiefly photosensitive polyimide and photosensitive polybenzoxazole — to pattern redistribution layers without a separate etch step. The claims in this dataset cluster around the practical problems that decide whether a dielectric survives assembly: sidewall profile control, cure temperature, residual stress, adhesion to copper, and elongation retention after thermal cycling. Each of these is a point where a formulation or process choice can be claimed independently of the base polymer chemistry.
The scope spans 2015 through the 2026-07-31 cut-off, drawing on 2,922 published records. Because publication trails filing by roughly 18 months, the most recent one to two years understate actual filing activity and should be read as provisional rather than a sign of a slowing field.
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Filing trend and technology composition
Two views of the same 2,922-record set: how filing activity has moved year over year, and which IPC subclasses carry the claims.
Filing activity, 2017–2026
Filings rose from 138 in 2017 to a peak of 339 in 2022, then eased; the 2021-to-2024 span still shows +8% growth (279 to 300), the last window unaffected by publication lag. Years after 2024 are not yet complete and should not be read as a decline.
IPC subclass composition
H01L (semiconductor devices) appears in 72.4% of records and H10W in 36.7%, confirming that most filings anchor in device structure rather than material chemistry alone. G03F (photolithography, 12.4%), H05K (printed circuits, 11.3%) and C08G (condensation polymers, 8.4%) mark narrower, more chemistry- or process-specific claim territory. A record can carry several classes, so these shares add to more than 100% of the 2,922 records in scope.
Shares are the percentage of the 2,922 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Wafer Level Packaging Photosensitive Dielectrics with Eureka
This page is one run against one query. Ask Eureka your own question about wafer level packaging photosensitive dielectrics and every answer comes back with the patent numbers behind it.
Try EurekaRepresentative and most-cited filings
US20220216190A1 — Semiconductor package
The filing discloses a semiconductor package built around a redistribution layer that embeds a photosensitive dielectric layer, with first, second and third redistribution patterns connecting to power and signal pads, plus a high-k dielectric pattern placed between the two power patterns. The photosensitive dielectric layer is the patterning medium for the redistribution structure itself, not a separate step added afterward.Filed by Samsung Electronics, published 2022-07-07.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US9372206B2 | Testing of semiconductor chips with microbumps | 1,842 |
| 2 | US20100246152A1 | Integrated circuit chip using top post-passivation technology and bottom structure technology | 456 |
| 3 | US5173442A | Methods of forming channels and vias in insulating layers | 322 |
| 4 | US20130200528A1 | Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP | 269 |
| 5 | US20160276307A1 | Semiconductor Device and Method of Forming POP Semiconductor Device with RDL Over Top Package | 267 |
| 6 | US5716663A | Multilayer printed circuit | 265 |
| 7 | US20070205520A1 | Chip package and method for fabricating the same | 236 |
| 8 | US5091339A | Trenching techniques for forming vias and channels in multilayer electrical interconnects | 199 |
| 9 | US20060065953A1 | Semiconductor die with protective layer and related method of processing a semiconductor wafer | 191 |
| 10 | US6011314A | Redistribution layer and under bump material structure for converting periphery conductive pads to an array o… | 191 |
Citation counts favour older filings in a searched corpus; treat them as a measure of influence on later filers, not of current commercial relevance.
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Reading the trend, the concentration figures and the citation table together points to a field with an occupied core and open edges.
Filing sits with a handful of leaders
The top five assignees combined account for 48.8% of all 2,922 records in scope, and the top ten reach 60.5%. That leaves a long tail of filers below tenth place, at 64 records, doing the remaining work.
Growth held even as early leaders pulled back
Total filings grew 8% from 2021 to 2024, the most recent span not distorted by publication lag, even though several of the field's earliest and largest filers show year-on-year declines approaching or reaching -100% in the latest tracked year.
Device claims dominate; process claims are thinner
H01L and H10W together anchor most filings in device structure. G03F, the subclass most directly tied to photolithographic patterning of the dielectric itself, covers just 12.4% of records — a narrower band where fewer claims compete for the same ground.
One early patent anchors the citation graph
US9372206B2 on testing microbumped chips draws 1,842 citations, far ahead of the next most-cited record at 456. That gap signals a foundational reference point for later filers rather than a currently contested claim.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to wafer level packaging photosensitive dielectrics, with the prior art for and against each one.
Assignee landscape
The assignee ranking returned by the data endpoint covers 100 companies, counted in records — not a top-50 or top-100 cut, just the full ranked list the dataset produces.
One assignee well ahead of the rest
The leading assignee holds 724 records, more than six times the fifth-place total of 107. That gap is wide enough that a freedom-to-operate review in this space should start with that filer's portfolio specifically, not the field average.
A tighter cluster just below the leader
From fifth to tenth place, record counts run from 107 down to 64 — a much shallower drop-off than between first and fifth. This mid-field is where competitive filing activity is most active.
Early leaders have slowed sharply
Several of the largest historical filers show steep year-on-year drops in the latest tracked year, some falling to zero. Given publication lag, this may reflect incomplete recent data as much as an actual pullback in filing.
Co-filing is rare and concentrated
Only 10 co-assignee pairs appear in the dataset, with the strongest pairs sharing 4 records each. Co-development in this space is the exception, not the norm — most filing is done by a single assignee alone.
| Assignee | Recent year | YoY |
|---|---|---|
| Samsung Electronics Co., Ltd. | 3 | -95% |
| Innolux Corporation | 3 | -91% |
| Taiwan Semiconductor Manufacturing Co., Ltd. | 0 | -100% |
| Silverbrook Research Pty Ltd | 0 | — |
| Applied Materials, Inc. | 0 | -100% |
| Shin-Etsu Chemical Co., Ltd. | 0 | -100% |
| STATS ChipPAC Pte. Ltd. | 0 | — |
| FUJIFILM Electronic Materials U.S.A., Inc. | 0 | — |
Where to take this
The landscape points to where claim space is dense and where it is thin. Turning that into a filing or freedom-to-operate decision means going deeper on specific claims.
Map claims against the leader's portfolio
With one assignee holding 724 of 2,922 records, a freedom-to-operate check for any new formulation or process claim should start there before surveying the rest of the field.
Run a portfolio comparison in EurekaProbe the under-claimed process branches
G03F-classed claims cover only 12.4% of records against H01L's 72.4%. That gap is worth testing against a specific formulation before assuming the space is open.
Explore white space in EurekaTrack momentum, not just totals
Several long-standing leaders show sharp recent-year drops in filing. Whether that is a real pullback or a publication-lag artefact matters for timing a filing decision.
Set up momentum tracking in EurekaCommon questions
In this dataset, the term covers photosensitive polyimide and photosensitive polybenzoxazole formulations used to pattern redistribution layers directly, without a separate photoresist and etch step. Claims typically address the material's behaviour during processing — cure temperature, sidewall profile after exposure and development, adhesion to the underlying copper, and elongation retention after thermal cycling. These properties matter because the dielectric has to survive both lithographic patterning and the mechanical stresses of subsequent packaging steps.
The assignee ranking is led by one company with 724 of the 2,922 records in scope, well ahead of the fifth-place holder at 107 records. The top five assignees combined hold 48.8% of all records, and the top ten hold 60.5%, indicating a field with a concentrated core and a long tail of smaller filers. Recent-year momentum data shows some of these same leaders filing far less in the latest tracked year, though publication lag means the most recent one to two years are still incomplete.
Complete-year data shows filings grew 8% from 279 in 2021 to 300 in 2024, with a peak of 339 in 2022. Numbers for 2025 and 2026 appear lower, but that reflects publication lag — patent applications typically publish around 18 months after filing — rather than an actual drop in filing activity. Any conclusion about a slowdown should wait until those later years are fully published.
H01L and H10W, both tied to general semiconductor device structure, cover 72.4% and 36.7% of the 2,922 records respectively. Narrower, process-specific subclasses like G03F (photolithography, 12.4%) and C08G (condensation polymers, 8.4%) are thinner, meaning fewer claims compete over specific formulation and patterning-process territory. Sub-areas like cure-temperature-tuned formulations, sidewall profile control for high-aspect vias, and adhesion promotion at copper interfaces sit in this less-crowded band.
One record, US9372206B2 on testing semiconductor chips with microbumps, holds 1,842 citations, roughly four times the next most-cited record at 456. That level of citation concentration usually signals a foundational reference that later filers built on, rather than a patent actively contested today. Citation counts in a searched corpus like this one favour older filings by design, so they should be read as a measure of influence, not current commercial weight.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.