GaN Power Module Patents: Leaders, Trends & White Space 2026
A data-driven look at 1,044 GaN power module patent families: who leads filing, how the technology mix breaks down across IPC classes, and where claim density is thin.
Filing growth = 2021 (88 records) → 2024 (39); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 1,044 records in scope (CR5), not the ranked leaders only.
What the GaN power module patent record shows
GaN power modules sit at the intersection of semiconductor device design and power conversion circuitry, and the patent record reflects that split cleanly: device-level claims under H01L and circuit-level claims under H02M together account for the majority of filing activity across the 1,044 records in scope. A third cluster, built around packaging and dual-side thermal management, has grown more recently and is where the newest claim activity concentrates. No single filer dominates the field — the leading assignee holds 46 records against a total of 1,044, and the top 10 combined hold just over a fifth of all filings.
Filing activity peaked in 2017 and has since declined through 2024, the most recent year with a complete picture given typical publication lag. That decline does not mean the underlying technology has stopped moving — it means the most contested claim territory was staked earlier, and later entrants are working the packaging and system-integration layers where density is still building.
Filing trends and technology composition
The filing curve and IPC composition below are drawn from the 1,044 records in scope for GaN power module filings, spanning receiving offices from the United States through WIPO's PCT route to Germany.
Filing activity peaked in 2017 and has since pulled back
Annual filings ran from 91 records in 2017, the peak year, down through 88 in 2021 to 39 in 2024 — a 56% decline over that three-year span. Publication lags filing by roughly 18 months, so 2025 and 2026 figures in the chart are still filling in and should not be read as a continued decline.
Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.
Semiconductor device and power conversion classes dominate
H01L (semiconductor devices) appears in 31.4% of the 1,044 records and H02M (power conversion) in 23.9%, together forming the backbone of the field. A record can carry several IPC classes, so these shares sum to more than 100% by design; the smaller classes — H03K, H02J, H04B, H03F and H05K — mark adjacent circuit and system applications rather than core module claims.
Shares are the percentage of the 1,044 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Wide-Bandgap Power Electronics: GaN Power Module Patent Landscape with Eureka
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Try EurekaA representative filing and the most-cited prior art
Stacked Intelligent GaN Power Module With Dual Side Cooling
Filed by Texas Instruments as a provisional application, this filing describes a stacked GaN power module architecture with cooling applied from both sides of the die — an approach aimed at improving thermal management density in compact power stages.Provisional filing (P0 suffix); claim scope not yet fixed through prosecution.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20160155629A1 | Formation of heteroepitaxial layers with rapid thermal processing to remove lattice dislocations | 474 |
| 2 | US20100302464A1 | Laser Based Display Method and System | 295 |
| 3 | US6634770B2 | Light source using semiconductor devices mounted on a heat sink | 289 |
| 4 | US8427590B2 | Laser based display method and system | 209 |
| 5 | US20030038291A1 | Semiconductor light source | 157 |
| 6 | US20110309325A1 | Light source module using quantum dots, backlight unit employing the light source module, display apparatus, … | 150 |
| 7 | US20200315708A1 | Systems, methods, and devices for developing patient-specific spinal implants, treatments, operations, and/or… | 145 |
| 8 | US20030039122A1 | Light source using semiconductor devices mounted on a heat sink | 133 |
| 9 | US20110057713A1 | Power module | 112 |
| 10 | US10627491B2 | Integrated LIDAR illumination power control | 108 |
Citation counts favour older filings that have had more time to accumulate citations within the searched corpus — read them as a signal of influence on the field's vocabulary, not as a measure of current commercial importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Four figures from the dataset that shape where to file, where to watch, and where competitive pressure is easing rather than building.
No single filer controls the field
The leading assignee holds 46 records and the top 5 combined hold 13.6% of all 1,044 records in scope. That leaves the majority of filing activity spread across a long tail, which raises the clearance burden for anyone doing freedom-to-operate work here.
Activity has pulled back from its 2017 peak
Filing peaked at 91 records in 2017 and has since declined, falling 56% between 2021 and 2024. Because publication lags filing by roughly 18 months, the most recent years in the trend understate current activity and should not be read as a continued drop.
Device-level claims are the densest single cluster
H01L (semiconductor devices) appears in 31.4% of the 1,044 records and H02M (power conversion) in 23.9% — together the backbone of the field. Smaller clusters like H10W (13.1%) mark where packaging and thermal architecture claims are still building density.
Filing strategy is US-centric with Europe second
The United States receives more filings than any other office at 482 records, with the European Patent Office second at 148 and WIPO's PCT route accounting for 87 — evidence that applicants are prioritising US protection before deciding on broader coverage.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to wide-bandgap power electronics: gan power module patent landscape, with the prior art for and against each one.
| Assignee | Co-assignee | Shared families |
|---|---|---|
| Technical University of Denmark | Technical University of Denmark | 1 |
Co-assignee activity in this dataset is sparse — the strongest pairing recorded involves a single joint filing between a university and its own institutional variant name, which suggests collaborative filing is not yet a significant pattern in this field.
Where to take this analysis next
The figures above establish the shape of the field. The next layer of work is claim-level: checking specific filings against a target design, or mapping the white space identified in the technology composition data.
Run a freedom-to-operate check against the packaging cluster
H10W filings covering stacked and dual-side-cooled architectures are the newest dense cluster in this dataset — worth a targeted clearance pass before committing to a similar layout.
Start a claim search in EurekaTrack the provisional filing through to grant
US63056271P0's eventual non-provisional claims will define the real blocking scope in dual-side-cooled GaN packaging — monitor the family rather than rely on the provisional text.
Set up family monitoring in EurekaMap the amplifier and PCB-assembly overlap
H03F and H05K classes show filing activity without a dominant single claimant, a pattern worth investigating for a defensible first-filer position.
Explore white space in EurekaQuestions practitioners ask about this field
The ranked leaders in this dataset span device makers, automotive OEMs and specialist GaN suppliers, with the top-ranked filer holding 46 of the 1,044 records in scope. Concentration is modest rather than extreme: the top 5 assignees together hold 13.6% of all records and the top 10 hold 21.3%, which means most of the field sits with a long tail of smaller filers rather than a small number of dominant players. That structure matters for freedom-to-operate work, because it means clearance searches need to cover many single- or few-filing entrants rather than just the largest names.
Filing peaked at 91 records in 2017 and declined to 39 by 2024, a 56% drop over that three-year window from 2021 to 2024. That is the most recent period that can be treated as complete, because publication typically lags filing by around 18 months, so the 2025 and 2026 figures in any trend chart are still filling in and should not yet be read as confirming a continued slowdown. The honest read is that the field passed its filing peak some years ago and has settled into a lower, steadier rate rather than an accelerating one.
The two largest IPC clusters are H01L (semiconductor devices), covering 31.4% of the 1,044 records, and H02M (power conversion circuitry), covering 23.9%. Beyond these, H10W appears in 13.1% of records and points to packaging and thermal management architectures such as stacked, dual-side-cooled modules. Smaller but still material clusters — H03K, H02J, H04B, H03F and H05K — reflect adjacent applications in pulse circuitry, grid power supply, transmission and printed circuit assembly, which is where less-contested claim space tends to sit.
The United States receives the largest share of filings in this dataset at 482 records, followed by the European Patent Office at 148 and filings routed through Israel's patent office at 113. WIPO's PCT route accounts for 87 records, reflecting applicants seeking multi-jurisdiction coverage before committing to national phase entry, while India and Germany each see a smaller but non-trivial share. Filing strategy in this field is clearly US-centric, with Europe as the largest secondary market.
US63056271P0, filed by Texas Instruments for a stacked intelligent GaN power module with dual-side cooling, is a provisional filing, which means its final claim scope has not yet been fixed through prosecution. It sits inside the H10W packaging cluster that covers 13.1% of the 1,044 records in scope, an area with real filing activity but no single dominant claimant. Teams working on dual-side-cooled stacked modules should track this family through to its non-provisional claims rather than assume the provisional text defines the eventual blocking scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.