LPBF Interlayer & Substrate Interface Patent Landscape
The LPBF interlayer and substrate interface space comprises 282 patent families and is in a confirmed growth stage, with a 67% increase in recent filings; RTX Corp holds the largest single position while Chinese academic institutions collectively dominate the mid-tier. China is the leading filing jurisdiction, reflecting heavy university-driven activity, while U.S. and European aerospace primes anchor the commercial tier.
RTX Corp leads a fragmented field anchored by aerospace primes and Chinese universities
RTX Corp is the single largest filer with 21 patent families, placing it clearly ahead of the next-ranked applicant, Shanghai Jiao Tong University with 11 patent families. The top five filers’ combined share of the hundred largest filers’ total stands at 23%, indicating a moderately fragmented competitive landscape rather than a monopolar one.
A clear two-tier structure is visible: one commercial aerospace prime (RTX Corp) occupies the top position, while the second through fifth ranks are held entirely by Chinese universities. The gap between RTX Corp at 21 patent families and the nearest university challengers is meaningful but not insurmountable, suggesting the leader’s position is based on focused filing rather than overwhelming volume.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | RTX Corp | 21 | |
| 2 | Shanghai Jiao Tong University | 11 | |
| 3 | NANJING UNIV OF AERONAUTICS & ASTRONAUTICS | 10 | |
| 4 | North University of China (Zhongbei University) | 9 | |
| 5 | South China University of Technology | 8 | |
| 6 | Jiangsu University | 8 | |
| 7 | Ecole Polytechnique Federale de Lausanne (EPFL) | 7 | |
| 8 | Northrop Grumman Systems Corporation | 7 | |
| 9 | National University of Singapore | 6 | |
| 10 | The Boeing Company | 6 |
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 11 | General Electric Company | 5 | |
| 12 | Wisconsin Alumni Research Foundation | 5 | |
| 13 | Central South University | 5 | |
| 14 | Commissariat a l’Energie Atomique et aux Energies Alternatives (CEA) | 5 | |
| 15 | Dualitas Ltd. | 4 | |
| 16 | Northwestern Polytechnical University | 4 | |
| 17 | The Government of the United States of America | 3 | |
| 18 | UNIV OF SCI & TECH BEIJING | 3 | |
| 19 | Renishaw plc | 3 | |
| 20 | Divergent Technologies Inc. | 3 |
RTX Corp’s lead implies a proprietary process-control and materials-interface strategy likely tied to turbine and structural aerospace components. China, which may translate into commercial applications or technology transfer in the near term.
Filing counts for 2024–2026 are understated due to standard patent publication lag; the apparent plateau at the most recent years should not be read as a slowdown. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Sustained filing growth with a powder-metallurgy and additive-manufacturing core
Annual filings have risen steadily since 2017, and the technology mix is overwhelmingly concentrated in B22F (powder metallurgy) and B33Y (additive manufacturing), with smaller adjacent clusters in alloys and welding sciences.
Annual filing trend
Filings grew from 10 patent families in 2017 to a recorded high of 60 in 2024, with 2025 and 2026 figures understated due to publication lag. The consistent upward trajectory from 2019 onward reflects broadening commercial interest beyond early research pioneers. The 67% recent-window growth confirms the field is still expanding.
↗ Hover for values · click a bar to ask EurekaTechnology composition
B22F (powder metallurgy) and B33Y (additive manufacturing) each account for the overwhelming majority of IPC classifications, confirming that core LPBF process and materials claims dominate the corpus. C22C (alloys) forms a meaningful secondary cluster, reflecting materials-development activity. Branches such as B23K (welding/soldering), C23C (coating and surface deposition), and C21D (heat treatment) appear at much lower counts, marking them as adjacent and relatively under-served areas.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Ultrafast laser shock forging assisted laser powde…
Provided is an ultrafast laser shock forging assisted laser powder bed fusion (LPBF) method with an ultrafast laser to allow on-line control of a stress field for an additive-manufactured component. Technical points of the present disclosure: During a LPBF-based additive manufacturing process, ultra-high-pressure shock waves induced byan ultrafast laser are… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Method and system for powder bed fusion additive m… | 43 |
| 2 | 一种制备高性能金刚石/铜复合材料的方法 | 30 |
| 3 | 基于激光选区熔化技术制备石墨烯增强铝合金材料的方法 | 29 |
| 4 | 一种基于SLM成形的铝基纳米复合材料及其制备方法 | 26 |
| 5 | 一种选区激光熔化装置及梯度材料的制备方法 | 22 |
| 6 | 一种轮盘式多材料激光选区熔化成型装置与方法 | 22 |
| 7 | 一种轮盘式多材料激光选区熔化成型装置与方法 | 21 |
| 8 | Dynamic Holography Non-Scanning Printing Device | 21 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the competitive structure means for R&D investment decisions
China-dominant filing geography creates a specific set of implications for teams evaluating entry or expansion.
Growth stage with rising annual volume
The field is classified as Growth, with annual filings still rising according to the lifecycle evidence and a 67% recent-window growth rate. The peak recorded year is 2024, and the evidence does not indicate any easing from that peak, so the upward trajectory is intact. Teams entering now are moving into an active, competitive space rather than a mature one with entrenched positions.
Growth stageModerate fragmentation with a single commercial leader
The top five filers account for 23% of the hundred largest filers’ combined total, indicating the field is not monopolized. RTX Corp’s lead of 21 patent families is significant but leaves room for challengers. The dense cluster of Chinese universities at ranks 2–6 means that academic IP may be licensable or acquirable, offering an alternative route to capability for commercial entrants.
Fragmented mid-tierUniversity-industry pairing is the dominant co-filing model
The most active co-filing relationships identified are Zhongbei University with AVIC Beijing Aeronautical Manufacturing Technology Research Institute (2 joint families), and South China University of Technology with Guangdong Huayi Sanitary Ware Industrial Co. and with Sun Yat-sen University Cancer Center (2 joint families each). Shanghai Jiao Tong University co-filed with East China University of Science and Technology, China United Heavy-Duty Gas Turbine Technology Co., and Shanghai Hanbang United 3D Technology Co. These pairings suggest that academic-to-industry knowledge transfer is the primary commercialization pathway in the Chinese segment.
Academic-industry linksChina leads filings; the U.S. and EPO form a meaningful second tier
China is the leading jurisdiction with 132 patent records, reflecting the high volume of university-origin filings. The United States follows with 79 records, and the EPO adds 38, together forming a commercially significant second tier. WIPO PCT filings number 23, indicating a subset of applicants pursuing broader international protection. Teams seeking freedom-to-operate in Western markets should prioritize U.S. and EPO prosecution strategies.
China-dominantGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
| Applicant | Collaborator | Co-filings |
|---|---|---|
| North University of China (Zhongbei University) | AVIC Beijing Aeronautical Manufacturing Technology Research Institute | 2 |
| South China University of Technology | Guangdong Huayi Sanitary Ware Industrial Co., Ltd. | 2 |
| South China University of Technology | Sun Yat-sen University Cancer Center | 2 |
| Shanghai Jiao Tong University | East China University of Science and Technology | 1 |
| Shanghai Jiao Tong University | China United Heavy-Duty Gas Turbine Technology Co., Ltd. | 1 |
| Shanghai Jiao Tong University | Shanghai Hanbang United 3D Technology Co., Ltd. | 1 |
| South China University of Technology | Ningbo Zhongke Xianglong Lightweight Technology Co., Ltd. | 1 |
| South China University of Technology | Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences | 1 |
| Jiangsu University | Wenzhou University Laser and Optoelectronic Intelligent Manufacturing Research Institute | 1 |
Co-filing pairs, ranked by the number of jointly-filed patent families.
RTX Corp anchors the commercial tier; Chinese universities drive volume in the challenger tier
Two distinct profiles define the top of the ranking: a single large aerospace prime with a tightly focused process-and-materials portfolio, and a set of Chinese academic institutions entering with broad LPBF fundamentals coverage.
RTX Corp
RTX Corp holds 21 patent families, the largest position in the corpus. Its technology emphasis is concentrated in B22F 10 (powder metallurgy process control) and B33Y 50/10 (additive manufacturing data and process), consistent with a focus on qualifying LPBF-built aerospace components with controlled interlayer properties. Momentum is flagged as a new entrant in the recent filing window, with 20 recent families, indicating that the bulk of RTX Corp’s position has been built rapidly and reflects an active, not legacy, filing program.
patent families: 21Jiangsu University
Jiangsu University holds 8 patent families and shows the strongest recent-period momentum among the academic challengers, with 7 recent families and a new-entrant trajectory. Its focus spans B22F 10, B33Y 10, and B33Y 80 (additive manufacturing end-product characterization), suggesting a research program that bridges process optimization and final-part qualification — directly relevant to interlayer and substrate interface performance.
patent families: 8| Applicant | Recent (3 yrs) | Trend |
|---|---|---|
| RTX Corp | 20 | ▲ new entrant |
| Shanghai Jiao Tong University | 4 | ▲ new entrant |
| Nanjing University of Aeronautics and Astronautics | 4 | ▲ new entrant |
| North University of China (Zhongbei University) | 2 | ▲ new entrant |
| South China University of Technology | 3 | ▲ new entrant |
| Jiangsu University | 7 | ▲ new entrant |
| Northrop Grumman Systems Corporation | 5 | ▲ new entrant |
| National University of Singapore | 3 | ▲ new entrant |
Under-served branches adjacent to the LPBF interlayer core
Several IPC branches appear at low counts relative to the dominant B22F/B33Y core, pointing to areas where inventive activity has been limited; some carry plausible technical relevance to interlayer and substrate interface challenges.
C23C · Coating & surface deposition
C23C accounts for only 17 patent records — roughly 2% of the IPC classifications observed — despite the direct technical relevance of surface deposition methods to substrate preparation and interlayer adhesion in LPBF builds. Pre-treatment coatings and functionally graded interface layers are active research topics in the broader literature but remain sparsely covered in this corpus. Teams working on substrate surface engineering before or during LPBF could find this branch relatively open, with an entry path through coupling C23C claims to B22F process claims in the same application.
Search this in Eureka →C21D · Heat treatment of metals
C21D covers only 14 patent records in this corpus, representing approximately 2% of IPC classifications observed, even though post-build and in-situ thermal treatment is a known lever for controlling residual stress and microstructural continuity at interlayer boundaries. The sparsity likely reflects a gap between thermal-processing specialists and LPBF process engineers rather than a lack of technical value. Applicants with dual expertise in alloy metallurgy and LPBF process control could find this branch accessible, particularly for high-temperature aerospace alloys where interlayer cracking is a documented failure mode.
Search this in Eureka →How leading applicants differ by IPC technology route
Route coverage across the main technology branches in the current evidence set.
| Player | B33Y 10 · Additive manufacturing (3D printing) | B22F 10 · Powder metallurgy | B33Y 70 · Additive manufacturing (3D printing) | B33Y 40 · Additive manufacturing (3D printing) | B33Y 50 · Additive manufacturing (3D printing) |
|---|---|---|---|---|---|
| RTX Corp | Strong · 13 | Strong · 21 | Absent | Absent | Strong · 18 |
| North University of China (Zhongbei University) | Strong · 10 | Strong · 7 | Moderate · 5 | Moderate · 4 | Emerging · 2 |
| Shanghai Jiao Tong University | Strong · 11 | Strong · 9 | Moderate · 3 | Emerging · 2 | Absent |
| Nanjing University of Aeronautics and Astronautics | Strong · 10 | Moderate · 5 | Strong · 10 | Absent | Absent |
| South China University of Technology | Strong · 8 | Strong · 7 | Moderate · 4 | Moderate · 4 | Moderate · 2 |
| Ecole Polytechnique Federale de Lausanne (EPFL) | Strong · 5 | Strong · 5 | Absent | Strong · 6 | Absent |
| National University of Singapore | Strong · 5 | Strong · 7 | Moderate · 3 | Absent | Absent |
Frequently asked questions
The corpus covers 282 patent families. This represents globally filed patents specifically addressing interlayer bonding, substrate adhesion, and related interface phenomena in laser powder bed fusion processes.
RTX Corp leads with 21 patent families, placing it ahead of Shanghai Jiao Tong University at 11 patent families and Nanjing University of Aeronautics and Astronautics at 10. RTX Corp’s recent filing momentum — flagged as a new entrant with 20 recent families — confirms this is an active, ongoing program rather than a legacy portfolio.
The field is classified as Growth. Annual filings have risen consistently, with a recorded peak of 60 patent families in 2024 and a 67% growth rate in the recent filing window. The 2025 and 2026 data points are understated due to publication lag and should not be interpreted as a slowdown.
China is the leading jurisdiction with 132 patent records, driven primarily by university-origin filings. The United States follows with 79 patent records, and the EPO adds 38, making these three jurisdictions the essential coverage targets for competitive monitoring and freedom-to-operate analysis.
B22F (powder metallurgy) and B33Y (additive manufacturing) each account for 278 IPC classifications and together form the overwhelming core of the corpus. C22C (alloys) is a meaningful secondary cluster. By contrast, C23C (coating and surface deposition) and C21D (heat treatment of metals) each appear at only around 2% of total IPC classifications, representing relatively sparse adjacent branches despite their technical relevance to substrate and interlayer control.
Yes. The most active co-filing relationships identified include Zhongbei University with AVIC Beijing Aeronautical Manufacturing Technology Research Institute, South China University of Technology with Guangdong Huayi Sanitary Ware Industrial Co., and Shanghai Jiao Tong University with East China University of Science and Technology and with China United Heavy-Duty Gas Turbine Technology Co. These pairings reflect a university-to-industry transfer model that is particularly prevalent in the Chinese segment of this landscape.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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